ZHCSEX5 April 2016 LM5175-Q1
PRODUCTION DATA.
PIN | DESCRIPTION | ||
---|---|---|---|
NO. | NAME | ||
1 | EN/UVLO | Enable pin. For EN/UVLO < 0.4 V, the LM5175-Q1 is in a low current shutdown mode. For 0.7 V < EN/UVLO < 1.23 V, the controller operates in standby mode in which the VCC regulator is enabled but the PWM controller is not switching. For EN/UVLO > 1.23 V, the PWM function is enabled, provided VCC exceeds the VCC UV threshold. | |
2 | VIN | The input supply pin to the IC. Connect VIN to a supply voltage between 3.5 V and 42 V. | |
3 | VISNS | VIN sense input. Connect to the input capacitor. | |
4 | MODE | Mode = GND, DCM, Hiccup Disabled (Set RMODE resistor to GND = 0 Ω) | |
Mode = 1.00 V, DCM, Hiccup Enabled (Set RMODE resistor to GND = 49.9 kΩ) | |||
Mode = 1.85 V, CCM, Hiccup Enabled (Set RMODE resistor to GND = 93.1 kΩ) | |||
Mode = VCC, CCM, Hiccup Disabled (Set RMODE resistor to VCC = 0 Ω) | |||
5 | DITH | A capacitor connected between the DITH pin and AGND is charged and discharged with a 10 uA current source. As the voltage on the DITH pin ramps up and down the oscillator frequency is modulated between –5% and +5% of the nominal frequency set by the RT resistor. Grounding the DITH pin will disable the dithering feature. In the external Sync mode, the DITH pin voltage is ignored. | |
6 | RT/SYNC | Switching frequency programming pin. An external resistor is connected to the RT/SYNC pin and AGND to set the switching frequency. This pin can also be used to synchronize the PWM controller to an external clock. | |
7 | SLOPE | A capacitor connected between the SLOPE pin and AGND provides the slope compensation ramp for stable current mode operation in both buck and boost mode. | |
8 | SS | Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start time. | |
9 | COMP | Output of the error amplifier. An external RC network connected between COMP and AGND compensates the regulator feedback loop. | |
10 | AGND | Analog ground of the IC. | |
11 | FB | Feedback pin for output voltage regulation. Connect a resistor divider network from the output of the converter to the FB pin. | |
12 | VOSNS | VOUT sense input. Connect to the output capacitor. | |
13 14 |
ISNS(–) ISNS(+) |
Input or Output Current Sense Amplifier inputs. An optional current sense resistor connected between ISNS(+) and ISNS(–) can be located either on the input side or on the output side of the converter. If the sensed voltage across the ISNS(+) and ISNS(-) pins reaches 50 mV, a slow Constant Current (CC) control loop becomes active and starts discharging the soft-start capacitor to regulated the drop across ISNS(+) and ISNS(-) to 50 mV. Short ISNS(+) and ISNS(-) together to disable this feature. | |
15 | CSG | The negative or ground input to the PWM current sense amplifier. Connect directly to the low-side (ground) of the current sense resistor. | |
16 | CS | The positive input to the PWM current sense amplifier. | |
17 | PGOOD | Power Good open drain output. PGOOD is pulled low when FB is outside a 0.8 V ±10% regulation window. | |
18 28 |
SW2 SW1 |
The boost and the buck side switching nodes respectively. | |
19 27 |
HDRV2 HDRV1 |
Output of the high-side gate drivers. Connect directly to the gates of the high-side MOSFETs. | |
20 26 |
BOOT2 BOOT1 |
An external capacitor is required between the BOOT1, BOOT2 pins and the SW1, SW2 pins respectively to provide bias to the high-side MOSFET gate drivers. | |
21 25 |
LDRV2 LDRV1 |
Output of the low-side gate drivers. Connect directly to the gates of the low-side MOSFETs. | |
22 | PGND | Power ground of the IC. The high current ground connection to the low-side gate drivers. | |
23 | VCC | Output of the VCC bias regulator. Connect capacitor to ground. | |
24 | BIAS | Optional input to the VCC bias regulator. Powering VCC from an external supply instead of VIN can reduce power loss at high VIN. For VBIAS > 8 V, the VCC regulator draws power from the BIAS pin. The BIAS pin voltage must not exceed 40 V. | |
- | PowerPAD™ | The PowerPAD should be soldered to the analog ground. If possible, use thermal vias to connect to a PCB ground plane for improved power dissipation. |