ZHCSTC5B October 2023 – June 2024 LM51772
PRODUCTION DATA
PIN | I/O(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
VCC1 | 1 | O | Auxiliary 5V regulator output. Place a capacitor close to the pin for good decoupling. If the output is disabled by the logic it can be tied to GND with a resistor or pulled to VCC2. Do not leave the pin floating. |
SS/ATRK | 2 | I/O | Soft-start programming pin. A capacitor between the SS pin and
AGND pin programs soft-start time. Analog output voltage tracking pin. The VOUT regulation target can be programmed by connecting the pin to variable voltage reference (for example, through a digital to analog converter). The internal circuit selects the lowest voltage between the pin voltage and the internal voltage reference. |
SYNC | 3 | I | Synchronization clock input/output. The internal oscillator can
be synchronized to an external clock during operation. Do not
leave this pin floating. If this function is not used,
connect the pin to VCC2 or GND. The SYNC pin can be configured as clock synchronization output signal. The clock phase can be selected to 0° and 180° to directly operate two devices in a parallel (dual phase) operation. |
DTRK | 4 | I | Digital PWM input pin for the dynamic output voltage tracking. Do not leave this pin floating. If this function is not used, connect the pin to VCC or GND. |
SDA/CFG3 | 5 | I/O | I2C interface serial data line. Connect an external a
pull-up resistor If I2C is disabled, this pin is a further configuration pin. Connect a resistor between the CFG3-pin and AGND to select the device operation according Section 7.3.22 |
SCL/CFG4 | 6 | I | I2C interface serial clock line. Connect an external a
pull-up resistor If I2C is disabled, this pin is a further configuration pin. Connect a resistor between the CFG4-pin and AGND to select the device operation according Section 7.3.22 |
MODE | 7 | I | Digital input to select device operation mode. If the pin is pulled low, power save mode (PSM) is enabled. If the pin is pulled high, the forced PWM or CCM operation is enabled. The configuration can be changed dynamically during operation. Do not leave this pin floating. |
CFG2 | 8 | I/O | Device configuration pin. Connect a resistor between the CFG2 pin and GND to select the device operation according the Section 7.3.22 |
ADDR/SLOPE(CFG1) | 9 | I |
Slope Compensation and Address selection. This pin also disables the I2C interface to use the SCL, SCA as additional slope configuration pins. Connect a resistor between the CFG1 pin and AGND to select the device operation according Section 7.3.22 |
CDC | 10 | Cable drop compensation or current monitor output pin. Connect a
resistor between the CDC pin and AGND to select the gain for the
cable drop compensation. Per default this pin provides a current monitoring signal of the sensed voltage between the ISNSP and ISNSN pins In case the current monitor is disabled connect CDC to ground |
|
nFLT/nINT | 11 | O | Open-drain output pin for fault indication or power good. This pin can be configured as interrupt pin. In case of a STATUS register change the pin toggles low for 256μs. |
RT | 12 | I/O | Switching frequency programming pin. An external resistor is connected to the RT pin and AGND to set the switching frequency |
COMP | 13 | O | Output of the error amplifier. An external RC network needs to be connected between COMP and AGND to stabilize/compensate the regulator voltage loop. |
FB/SEL_intFB | 14 | I | Feedback pin for output voltage regulation. Connect a resistor
divider network from the output of the converter to the FB pin.
Connect the FB pin to VCC2 to operate at a fixed output voltage
default setting of the device. To select the internal feedback connect the pin to VCC2 before the device start-up |
VIN-FB | 15 |
VIN sense pin. Connect to a VIN divider with the same gain as the VOUT divider for using PCM with external divider. If the internal Vout divider or if PCM is not used, connect to AGND. Do not leave floating. |
|
ILIMCOMP/ISET | 16 | Compensation pin for average current limit loop. Connect an
capacitor or a type 2 R-C network if the current limit is set by the
internal DAC. If the internal DAC is disabled the pin sets the current limit threshold for the average current limit. Connect a resistor to AGND. A parallel filter of capacitor is recommended depending on the application requirements Connect a resistor to AGND if the current limit is set by ISET. Connect the ISET pin to VCC2 to disable the block and reduce the quiescent current |
|
AGND | 17 | G | Analog Ground |
VOUT | 18 | I | Output voltage sense input. Connect to the power stage output rail. |
ISNSN | 19 | I | Negative sense input of the output or input average current sense
amplifier. An optional current sense resistor connected between
ISNSN and ISNSP can be located either on the input side or on the
output side of the power stage. In case the optional current sensor is disabled connect ISNSN and ISNSP together to AGND |
ISNSP | 20 | I | Positive sense input of the output or input current sense
amplifier. An optional current sense resistor connected between
ISNSN and ISNSP can be placed either on the input side or on the
output side of the power stage. In case the optional current sensor is disabled connect ISNSP to ground |
CSB | 21 | I | Inductor peak current sense negative input. Connect CSB to the negative side of the external current sense resistor using a Kelvin connection. |
CSA | 22 | I | Inductor peak current sense positive input. Connect CSA to the positive side of the external current sense resistor using a Kelvin connection. |
SW1 | 23 | P | Inductor switch node for the buck half-bridge |
HO1 | 24 | O | High-side gate driver output for the buck half-bridge |
HB1 | 25 | P | Bootstrap supply pin for buck half-bridge. An external capacitor
is required between the HB1 pin and the SW1 pin, to provide bias to
the high-side MOSFET gate driver. Place the external capacitor close to the pin without any resistance between the pin and capacitor for good decoupling |
NC | 26 | O | Not Connected |
LO1 | 27 | O | Low-side gate driver output for the buck half-bridge |
PGND | 28 | G | Power Ground |
VCC2 | 29 | O | Internal linear bias regulator output. Connect a ceramic
decoupling capacitor from VCC to PGND. This rail supplies the
internal logic and the gate driver. Place the external capacitor close to the pin without any resistance between the pin and capacitor for good decoupling. |
LO2 | 30 | O | Low-side gate driver output for the boost half-bridge |
HB2 | 31 | P | Bootstrap supply pin for boost half-bridge. An external capacitor
is required between the HB2 pin and the SW2 pin, to provide bias to
the high-side MOSFET gate driver Place the external capacitor close to the pin without any resistance between the pin and capacitor for good decoupling |
HO2 | 32 | O | High-side gate driver output for the boost half-bridge |
SW2 | 33 | P | Inductor switch node for the buck half-bridge |
NC | 34 | O | Not Connected |
DRV1 | 35 | External FET drive pin. This pin features a high-voltage push
pull stage, a open drain output or a charge pump driver stage
according to the selected configuration. In case the optional DRV pin is not used you can leave DRV open. |
|
VIN | 36 | I | The input supply and sense input of the device. Connect VIN to the supply voltage of the power stage. |
EN/UVLO | 37 | I | Enable pin. Digital input pin to enable the converter
switching. The input features a precise analog comparator and a hysteresis to monitor the input voltage. Connect a resistor divider from the input voltage to maintain the under voltage lookout(UVLO) feature. |
nRST | 38 | I | Digital input pin to enable the device internal logic, interface operation and the VCC1 regulator if selected. |
NC | 39 | O | Not Connected |
BIAS | 40 | Optional input to the VCC2 bias regulator. Powering VCC2 from an external supply instead of VIN can reduce power loss at high VIN. | |
GND | PAD | G | Thermal pad |