ZHCSL47A April   2020  – January 2021 LM5181

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Integrated Power MOSFET
      2. 8.3.2  PSR Flyback Modes of Operation
      3. 8.3.3  Setting the Output Voltage
        1. 8.3.3.1 Diode Thermal Compensation
      4. 8.3.4  Control Loop Error Amplifier
      5. 8.3.5  Precision Enable
      6. 8.3.6  Configurable Soft Start
      7. 8.3.7  External Bias Supply
      8. 8.3.8  Minimum On-Time and Off-Time
      9. 8.3.9  Overcurrent Protection
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1: Wide VIN, Low IQ PSR Flyback Converter Rated at 5 V, 0.5 A
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 9.2.1.2.3  Flyback Transformer – T1
          4. 9.2.1.2.4  Flyback Diode – DFLY
          5. 9.2.1.2.5  Zener Clamp Circuit – DF, DCLAMP
          6. 9.2.1.2.6  Output Capacitor – COUT
          7. 9.2.1.2.7  Input Capacitor – CIN
          8. 9.2.1.2.8  Feedback Resistor – RFB
          9. 9.2.1.2.9  Thermal Compensation Resistor – RTC
          10. 9.2.1.2.10 UVLO Resistors – RUV1, RUV2
          11. 9.2.1.2.11 Soft-Start Capacitor – CSS
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)LM5181  UNIT
NGU (WSON)
8 PINS
RΘJAJunction-to-ambient thermal resistance41.3°C/W
RΘJC(top)Junction-to-case (top) thermal resistance34.7°C/W
RΘJBJunction-to-board thermal resistance19.1°C/W
ΨJTJunction-to-top characterization parameter0.3°C/W
ΨJBJunction-to-board characterization parameter19.2°C/W
RΘJC(bot)Junction-to-case (bottom) thermal resistance3.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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