ZHCSFV3 November   2016 LM53602 , LM53603

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 RESET Flag Output
      2. 8.3.2 Enable and Start-Up
      3. 8.3.3 Current Limit
      4. 8.3.4 Synchronizing Input
      5. 8.3.5 Input Supply Current
      6. 8.3.6 UVLO and TSD
    4. 8.4 Device Functional Modes
      1. 8.4.1 AUTO Mode
      2. 8.4.2 FPWM Mode
      3. 8.4.3 Dropout
      4. 8.4.4 Input Voltage Frequency Fold-Back
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical and Full-Featured Industrial Application Circuits
        1. 9.2.1.1 Design Parameters
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting the Output Voltage
          2. 9.2.1.2.2 Output Capacitors
          3. 9.2.1.2.3 Input Capacitors
          4. 9.2.1.2.4 Inductor
          5. 9.2.1.2.5 VCC
          6. 9.2.1.2.6 BIAS
          7. 9.2.1.2.7 CBOOT
          8. 9.2.1.2.8 Maximum Ambient Temperature
        3. 9.2.1.3 Application Curves
    3. 9.3 Typical Adjustable Industrial Application Circuit
      1. 9.3.1 Design Parameters for Typical Adjustable Output Industrial Power Supply
    4. 9.4 Do's and Don't's
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Plane Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档　
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

PWP Package
16-Lead HTSSOP
Top View
LM53602 LM53603 connect1.gif

Pin Functions

PIN I/O(1) DESCRIPTION
NO. NAME
1, 2 SW P Regulator switch node. Connect to power inductor. Connect pins 1 and 2 directly together at the PCB.
3 CBOOT P Bootstrap supply input for gate drivers. Connect a high-quality, 470-nF capacitor from this pin to SW.
4 VCC O Internal 3.15-V regulator output. Used as supply to internal control circuits. Do not connect to any external loads. Can be used as logic supply for control inputs. Connect a high-quality, 3.3-µF capacitor from this pin to GND.
5 BIAS P Input to internal voltage regulator. Connect to output voltage point. Do not ground. Connect a high-quality, 0.1-µF capacitor from this pin to GND.
6 SYNC I Synchronization input to regulator. Used to synchronize the regulator switching frequency to the system clock. When not used connect to GND; do not float.
7 FPWM I Mode control input to regulator. High = forced PWM (FPWM). Low = auto mode; automatic transition between PFM and PWM. Do not float.
8 RESET O Open-drain reset output. Connect to suitable voltage supply through a current limiting resistor. High = power OK. Low = fault. RESET goes low when EN = low.
9 FB I Feedback input to regulator. Connect to output voltage sense point for fixed 5-V and 3.3-V output. Connect to feedback divider tap point for ADJ option. Do not float or ground.
10 AGND G Analog ground for regulator and system. All electrical parameters are measured with respect to this pin. Connect to EP and PGND on PCB.
11 EN I Enable input to the regulator. High = ON. Low = OFF. Can be connected directly to VIN. Do not float.
12, 13 VIN P Input supply to the regulator. Connect a high-quality bypass capacitor(s) from this pin to PGND. Connect pins 12 and 13 directly together at the PCB.
14 N/C — This pin has no connection to the device.
15, 16 PGND G Power ground to internal low-side MOSFET. Connect to AGND and system ground. Connect pins 15 and 16 directly together at the PCB.
17 EP G Exposed die attach paddle. Connect to ground plane for adequate heat sinking and noise reduction.
(1) O = Output, I = Input, G = Ground, P = Power
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