ZHCSHU8F October   2008  – July 2019 LM5575-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown and Standby
      2. 7.3.2 Current Limit
      3. 7.3.3 Soft Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 High-Voltage Start-Up Regulator
      2. 7.4.2 Oscillator and Sync Capability
      3. 7.4.3 Error Amplifier and PWM Comparator
      4. 7.4.4 Ramp Generator
      5. 7.4.5 BOOST Pin
      6. 7.4.6 Maximum Duty Cycle and Input Dropout Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bias Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  External Components
        3. 8.2.2.3  R3 (RT)
        4. 8.2.2.4  L1
        5. 8.2.2.5  C3 (CRAMP)
        6. 8.2.2.6  C9, C10
        7. 8.2.2.7  D1
        8. 8.2.2.8  C1, C2
        9. 8.2.2.9  C8
        10. 8.2.2.10 C7
        11. 8.2.2.11 C4
        12. 8.2.2.12 R5, R6
        13. 8.2.2.13 R1, R2, C12
        14. 8.2.2.14 R7, C11
        15. 8.2.2.15 R4, C5, C6
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.4 Thermal Protection

Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction temperature is exceeded. When activated (typically at 180°C), the controller is forced into a low-power reset state, which disables the output driver and the bias regulator. This feature is provided to prevent catastrophic failures from accidental device overheating.
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