9.2.2.10 Maximum Ambient Temperature

As with any power conversion device, the LM604x0-Q1 dissipates internal power while operating. The effect of this power dissipation is to raise the internal temperature of the converter above ambient. The internal die temperature (T_J) is a function of the ambient temperature, the power loss and the effective thermal resistance, R_θJA of the device and PCB combination. The maximum internal die temperature for the LM604x0-Q1 must be limited to 150°C. This establishes a limit on the maximum device power dissipation and therefore the load current. Equation 10 shows the relationships between the important parameters. It is easy to see that larger ambient temperatures (T_A) and larger values of R_θJA reduce the maximum available output current. The converter efficiency can be estimated by using the curves provided in this data sheet. If the desired operating conditions cannot be found in one of the curves, then interpolation can be used to estimate the efficiency. Alternatively, the EVM can be adjusted to match the desired application requirements and the efficiency can be measured directly. The correct value of R_θJA is more difficult to estimate. As stated in the Semiconductor and IC Package Thermal Metrics Application Report, the value of R_θJA given in the Thermal Information table is not valid for design purposes and must not be used to estimate the thermal performance of the application. The values reported in that table were measured under a specific set of conditions that are rarely obtained in an actual application.

Equation 10.

where

• η = efficiency

The effective R_θJA is a critical parameter and depends on many factors such as power dissipation, air temperature/flow, PCB area, copper heat-sink area, number of thermal vias under the package, and adjacent component placement; to mention just a few. The copper area given in the graph is for each layer; the top and bottom layers are 2 oz. copper each, while the inner layers are 1 oz. It must be remembered that the data given in these graphs are for illustration purposes only, and the actual performance in any given application depends on all of the previously mentioned factors.