ZHCSKA7F
May 2019 – June 2021
LM61460-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Description (continued)
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
计时特性
8.7
Systems Characteristics
8.8
Typical Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
EN/SYNC Uses for Enable and VIN UVLO
9.3.2
EN/SYNC Pin Uses for Synchronization
9.3.3
Clock Locking
9.3.4
Adjustable Switching Frequency
9.3.5
PGOOD Output Operation
9.3.6
Internal LDO, VCC UVLO, and BIAS Input
9.3.7
Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
9.3.8
Adjustable SW Node Slew Rate
9.3.9
Spread Spectrum
9.3.10
Soft Start and Recovery From Dropout
9.3.11
Output Voltage Setting
9.3.12
Overcurrent and Short Circuit Protection
9.3.13
Thermal Shutdown
9.3.14
Input Supply Current
9.4
Device Functional Modes
9.4.1
Shutdown Mode
9.4.2
Standby Mode
9.4.3
Active Mode
9.4.3.1
CCM Mode
9.4.3.2
Auto Mode - Light Load Operation
9.4.3.2.1
Diode Emulation
9.4.3.2.2
Frequency Reduction
9.4.3.3
FPWM Mode - Light Load Operation
9.4.3.4
Minimum On-time (High Input Voltage) Operation
9.4.3.5
Dropout
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Choosing the Switching Frequency
10.2.2.2
Setting the Output Voltage
10.2.2.3
Inductor Selection
10.2.2.4
Output Capacitor Selection
10.2.2.5
Input Capacitor Selection
10.2.2.6
BOOT Capacitor
10.2.2.7
BOOT Resistor
10.2.2.8
VCC
10.2.2.9
BIAS
10.2.2.10
CFF and RFF Selection
10.2.2.11
External UVLO
10.2.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.1.1
Ground and Thermal Considerations
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.1.1
Related Documentation
13.2
接收文档更新通知
13.3
支持资源
13.4
Trademarks
13.5
静电放电警告
13.6
术语表
14
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RJR|14
MPQF507D
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcska7f_oa
zhcska7f_pm
12.2
Layout Example
Figure 12-2
Layout Example
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