ZHCSKX9D
May 2019 – July 2022
LM61460
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
ESD Ratings
7.2
Recommended Operating Conditions
7.3
Thermal Information
7.4
Electrical Characteristics
7.5
Timing Characteristics
7.6
Systems Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
EN/SYNC Uses for Enable and VIN UVLO
8.3.2
EN/SYNC Pin Uses for Synchronization
8.3.3
Clock Locking
8.3.4
Adjustable Switching Frequency
8.3.5
PGOOD Output Operation
8.3.6
Internal LDO, VCC UVLO, and BIAS Input
8.3.7
Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
8.3.8
Adjustable SW Node Slew Rate
8.3.9
Spread Spectrum
8.3.10
Soft Start and Recovery From Dropout
8.3.11
Output Voltage Setting
8.3.12
Overcurrent and Short Circuit Protection
8.3.13
Thermal Shutdown
8.3.14
Input Supply Current
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
8.4.3.1
CCM Mode
8.4.3.2
Auto Mode – Light-Load Operation
8.4.3.2.1
Diode Emulation
8.4.3.2.2
Frequency Reduction
8.4.3.3
FPWM Mode – Light-Load Operation
8.4.3.4
Minimum On-Time (High Input Voltage) Operation
8.4.3.5
Dropout
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Choosing the Switching Frequency
9.2.2.2
Setting the Output Voltage
9.2.2.3
Inductor Selection
9.2.2.4
Output Capacitor Selection
9.2.2.5
Input Capacitor Selection
9.2.2.6
BOOT Capacitor
9.2.2.7
BOOT Resistor
9.2.2.8
VCC
9.2.2.9
BIAS
9.2.2.10
CFF and RFF Selection
9.2.2.11
External UVLO
9.2.3
Application Curves
9.2.4
USB Type-C System Example
9.2.4.1
Design Requirements
9.2.4.2
Detailed Design Procedure
9.2.4.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Ground and Thermal Considerations
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RJR|14
MPQF507D
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcskx9d_oa
zhcskx9d_pm
8
Detailed Description
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