100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Standard quad-flat no-lead (VQFN) packages do not have solderable or exposed pins and terminals that are easily viewed. Therefore, visually determining whether or not the package is successfully soldered onto the printed-circuit board (PCB) is difficult. The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LM644x0-Q1 is assembled using a 22-pin Enhanced HotRod QFN package with wettable flanks to provide a visual indicator of solderability, which reduces the inspection time and manufacturing costs.