For a DC/DC converter to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The LM70880-Q1 is available in a small 6-mm × 6-mm 29-pin QFN integrated circuit package to cover a range of application requirements. Thermal Design and Layout summarizes the thermal metrics of this package.

Numerous vias with a 0.3-mm diameter connected from the thermal pads to the internal and solder-side plane or planes are vital to help dissipation. In a multi-layer PCB design, a solid GND plane is typically placed on the PCB layer below the power components. Not only does this action provide a plane for the power stage currents to flow but this action also represents a thermally conductive path away from the heat generating devices.