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ZHCSSM5D May 1999 – February 2024 LM7171

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM7171			UNIT
		D (SOIC) A Version	D (SOIC) B Version	P (PDIP)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	122.5	172	108	℃/W
R_θJC(top)	Junction-to-case (top) thermal resistance	64.7	62.4	52.4	℃/W
R_θJB	Junction-to-board thermal resistance	65.9	55.7	51.9	℃/W
Ψ_JT	Junction-to-top characterization parameter	17.6	16.5	6.8	℃/W
Ψ_JB	Junction-to-board characterization parameter	65.1	55.1	51.1	℃/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	℃/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.