ZHCSLY9A October   2020  – December 2020 LM7310

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8.     14
    9. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Reverse Polarity Protection
      2. 7.3.2 Undervoltage Protection (UVLO & UVP)
      3. 7.3.3 Overvoltage Lockout (OVLO)
      4. 7.3.4 Inrush Current control and Fast-trip
        1. 7.3.4.1 Slew Rate (dVdt) and Inrush Current Control
        2. 7.3.4.2 Fast-Trip During Steady State
      5. 7.3.5 Analog Load Current Monitor Output
      6. 7.3.6 Reverse Current Protection
      7. 7.3.7 Overtemperature Protection (OTP)
      8. 7.3.8 Fault Response
      9. 7.3.9 Power Good Indication (PG)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Single Device, Self-Controlled
      1. 8.2.1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Setting Undervoltage and Overvoltage Thresholds
          2. 8.2.1.2.2 Setting Output Voltage Rise Time (tR)
          3. 8.2.1.2.3 Setting Power Good Assertion Threshold
          4. 8.2.1.2.4 Setting Analog Current Monitor Voltage (IMON) Range
        3. 8.2.1.3 Application Curves
    3. 8.3 Active ORing
    4. 8.4 Priority Power MUXing
    5. 8.5 USB PD Port Protection
    6. 8.6 Parallel Operation
  9. 9 Power Supply Recommendations
    1. 9.1 Transient Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Switching Characteristics

The output rising slew rate is internally controlled and constant across the entire operating voltage range to ensure the turn on timing is not affected by the load conditions. The rising slew rate can be adjusted by adding capacitance from the dVdt pin to ground. As CdVdt is increased it will slow the rising slew rate (SR). See Slew Rate and Inrush Current Control (dVdt) section for more details. The Turn-Off Delay and Fall Time, however, are dependent on the RC time constant of the load capacitance (COUT) and Load Resistance (RL). The Switching Characteristics are only valid for the power-up sequence where the supply is available in steady state condition and the load voltage is completely discharged before the device is enabled.Typical Values are taken at TJ = 25°C unless specifically noted otherwise. RL = 100 Ω, COUT = 1 µF 
PARAMETER VIN
CdVdt = Open CdVdt = 1800 pF CdVdt = 3300 pF UNIT
SRON Output Rising slew rate 2.7 V 12.14 0.87 0.5 V/ms
12 V 28.1 1.09 0.61
23 V 44.78 1.25 0.71
tD,ON Turn on delay 2.7 V 0.09 0.6 0.97 ms
12 V 0.1 1.32 2.35
23 V 0.11 1.99 3.69
tR Rise time 2.7 V 0.17 2.51 4.33 ms
12 V 0.35 8.1 15.37
23 V 0.40 14.4 25.89
tON Turn on time 2.7 V 0.27 3.11 5.31 ms
12 V 0.45 10.08 17.72
23 V 0.50 16.41 29.57
tD,OFF Turn off delay 2.7 V 64.44 64.44 64.44 µs
12 V 25.32 25.32 25.32
23 V 23.02 23.02 23.02
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