ZHCSH35B November   2017  – May 2021 LM73605-Q1 , LM73606-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Synchronous Step-Down Regulator
      2. 8.3.2  Auto Mode and FPWM Mode
      3. 8.3.3  Fixed-Frequency Peak Current-Mode Control
      4. 8.3.4  Adjustable Output Voltage
      5. 8.3.5  Enable and UVLO
      6. 8.3.6  Internal LDO, VCC_UVLO, and BIAS Input
      7. 8.3.7  Soft Start and Voltage Tracking
      8. 8.3.8  Adjustable Switching Frequency
      9. 8.3.9  Frequency Synchronization and Mode Setting
      10. 8.3.10 Internal Compensation and CFF
      11. 8.3.11 Bootstrap Capacitor and VBOOT-UVLO
      12. 8.3.12 Power-Good and Overvoltage Protection
      13. 8.3.13 Overcurrent and Short-Circuit Protection
      14. 8.3.14 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 DCM Mode
        3. 8.4.3.3 PFM Mode
        4. 8.4.3.4 Fault Protection Mode
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Layout For EMI Reduction
      2. 9.1.2 Ground Plane
      3. 9.1.3 Optimize Thermal Performance
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 支持资源
    7. 10.7 Trademarks
    8. 10.8 Electrostatic Discharge Caution
    9. 10.9 Glossary

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)LM73605/LM73606UNIT
RNP (WQFN)
30 PINS
RθJAJunction-to-ambient thermal resistance34.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance14.6°C/W
RθJBJunction-to-board thermal resistance7.3°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter7.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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