米6体育平台手机版

ZHCSJE7A March 2019 – September 2019 LM76202-Q1

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

PWP|16

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.6 Typical Characteristics

T_A = 25 °C, V_(IN) = 12 V, V_(SHDN)= 2 V, R_(ILIM) = 120 kΩ, IMON = FLT = OPEN, C_(IN) = 0.1 μF, C_(OUT) = 1 μF, C_(dVdT)= OPEN. (Unless otherwise noted)

Figure 1. POR Threshold (V_POR) vs Temperature

Figure 3. Supply Current OFF (IQ_OFF) vs Supply Voltage (V_IN)

Figure 5. OVP Thresholds (V_OVPR, V_OVPF) vs Temperature

Figure 7. I_LIM vs R_ILIM

Figure 9. I_LIM Accuracy vs Temperature with V_IN = 12 V

Figure 11. I_MON vs I_OUT

V_(OUT) = 24 V

V_(IN) = 0 V

V_SHDN = 0 V

Figure 13. I_lkg(OUT) vs Temperature with V_IN = 0 V

Figure 15. V_REVTH vs Temperature

Figure 17. I_LIM Accuracy vs Temperature with V_IN = 24 V

Figure 2. Supply Current ON (IQ_ON) vs Supply Voltage (V_IN)

Figure 4. UVLO Thresholds (V_UVLOR, V_UVLOF) vs Temperature

Figure 6. GAIN_(dVdT) vs Temperature

T_A = -40 to 125 °C

Figure 8. I_LIM Accuracy vs Supply Voltage

Figure 10. GAIN_(IMON) vs Temperature

Figure 12. R_ON vs Temperature

V_(OUT) = 0 V

V_(IN) = –24 V

V_SHDN = 0 V

Figure 14. I_lkg(OUT) vs Temperature with V_IN = –24 V

Figure 16. V_FWDTH vs Temperature

Taken on 2-layer PCB with 0.07-mm thick copper and copper area of 10.5 cm² connected to PowerPAD.

Figure 18. Thermal Shutdown Time vs Power Dissipation