SNOS469J April   2000  – January 2015 LM8261

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 2.7 V
    6. 6.6 Electrical Characteristics 5 V
    7. 6.7 Electrical Characteristics ±15 V
    8. 6.8 Typical Characteristics
  7. Application and Implementation
    1. 7.1 Block Diagram and Operational Description
      1. 7.1.1  A) Input Stage
      2. 7.1.2 B) Output Stage
    2. 7.2 Driving Capacitive Loads
    3. 7.3 Estimating the Output Voltage Swing
    4. 7.4 TFT Applications
    5. 7.5 Output Short Circuit Current and Dissipation Issues
    6. 7.6 Other Application Hints
      1. 7.6.1 LM8261 Advantages
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Power Supply Recommendations

The LM8261 can operate off a single supply or with dual supplies. The input CM capability of the parts (CMVR) extends covers the entire supply voltage range for maximum flexibility. Supplies should be decoupled with low inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins. The use of ground plane is recommended, and as in most high speed devices, it is advisable to remove ground plane close to device sensitive pins such as the inputs.