SNVS233C March   2003  – December 2015 LM8365

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset Output Low
      2. 7.4.2 Reset Output High
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

See (1)(2).
MIN MAX UNIT
Supply voltage −0.3 6.5 V
RESET output voltage −0.3 6.5 V
RESET output current 70 mA
Mounting temperature Lead temp. (soldering 10 sec) 260 °C
Junction temperature 125 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.

6.3 Recommended Operating Conditions(1)

MIN MAX UNIT
Temperature −40 85 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics.

6.4 Thermal Information

THERMAL METRIC(1) LM8365 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 191.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 144.6 °C/W
RθJB Junction-to-board thermal resistance 35.9 °C/W
ψJT Junction-to-top characterization parameter 31.1 °C/W
ψJB Junction-to-board characterization parameter 35.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified, all limits specified for TA = 25°C.
PARAMETER TEST CONDITIONS MIN(2) TYP(1) MAX(2) UNIT
VDET− Detector threshold voltage High-to-low state output
(VIN decreasing) 		27 suffix 2.633 2.7 2.767 V
45 suffix 4.388 4.5 4.613
VHYS Detector threshold hysteresis VIN increasing 27 suffix 0.081 0.135 0.189 V
45 suffix 0.135 0.225 0.315
ΔVdet/ΔT Detector threshold voltage temperature coefficient ±100 PPM/°C
VOL RESET output voltage Open-drain
ISINK = 1 mA		 0.25 0.5 V
IOL RESET output sink current VIN = 1.5 V, VOL = 0.5 V 1 2.5 mA
IOH RESET output source current VIN = 4.5 V, VOL = 2.4 V 1 7 mA
ICD Delay pin output sink current VIN = 1.5 V, VCD = 0.5 V 0.2 1.8 mA
RD Delay resistance 0.5 1 2 MΩ
VIN Operating input voltage range 1 6 V
IIN Quiescent input current 27 suffix  VIN = 2.6 V 0.62 0.9 μA
 VIN = 4.7 V 0.75 1.3
45 suffix  VIN = 4.34 V 0.7 1
 VIN = 6 V 0.85 1.4
(1) Typical values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
LM8365 20066017.gif Figure 1. Timing Waveforms
LM8365 20066016.gif Figure 2. Propagation Delay Timing Diagrams

6.6 Typical Characteristics

LM8365 20066001.gif
Figure 3. Input Current vs Input Voltage LM8365BALMF45
LM8365 20066003.gif
Figure 5. Reset Output Sink Current vs Input Voltage LM8365BALMF27
LM8365 20066006.gif
Figure 7. CD Sink Current vs Input Voltage LM8365BALMF27
LM8365 20066008.gif
Figure 9. CD Delay Pin Threshold Voltage vs Temperature LM8365BALMF27
LM8365 20066010.gif
Figure 11. Delay Resistance vs Temperature
LM8365 20066002.gif
Figure 4. Reset Output Voltage vs Input Voltage LM8365BALMF45
LM8365 20066005.gif
Figure 6. Reset Output Sink Current vs Reset Output Voltage LM8365BALMF45
LM8365 20066007.gif
Figure 8. CD Sink Current vs CD Voltage
LM8365 20066009.gif
Figure 10. Detector Threshold Voltage vs Temperature LM8365BALMF45
LM8365 20066011.gif
Figure 12. Output Time Delay vs Capacitance
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