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ZHCSJ84 December 2018 LM95071-Q1

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		LM95071-Q1	UNIT
		DBV (SOT-23)
		5 PINS
R_θJA	Junction-to-ambient thermal resistance	167.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	118.8	°C/W
R_θJB	Junction-to-board thermal resistance	30.7	°C/W
ψ_JT	Junction-to-top characterization parameter	14.4	°C/W
ψ_JB	Junction-to-board characterization parameter	30.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.