ZHCSJ84 December   2018 LM95071-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      温度监控器应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics - Digital DC Characteristics
    7. 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Up and Power Down
      2. 8.3.2 Temperature Data Format
      3. 8.3.3 Tight Accuracy, Fine Resolution and Low Noise
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode/Manufacturer ID
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Interface
      2. 8.5.2 Serial Bus Timing Diagrams
    6. 8.6 Register Maps
      1. 8.6.1 Internal Register Structure
        1. 8.6.1.1 Configuration Register
        2. 8.6.1.2 Temperature Register
        3. 8.6.1.3 Manufacturer/Device ID Register
  9. 9 器件和文档支持
    1. 9.1 接收文档更新通知
    2. 9.2 社区资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 术语表
  10. 10机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings (1)(4)(3)

MIN MAX UNIT
Supply voltage −0.3 6 V
Voltage at any pin −0.3 VDD + 0.3 V
Input current at any pin (2) 5 mA
Storage temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to 5 mA.
(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.
(4) Soldering process must comply with Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging.
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