ZHCSIZ1G May   2010  – November 2018 LM98640QML-SP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings    
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information         
    5. 6.5 Quality Conformance Inspection
    6. 6.6 LM98640QML-SP Electrical Characteristics
    7. 6.7 AC Timing Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sampling Modes
        1. 7.3.1.1 Sample & Hold Mode
          1. 7.3.1.1.1 Sample & Hold Mode CLAMP/SAMPLE Adjust
        2. 7.3.1.2 CDS Mode
          1. 7.3.1.2.1 CDS Mode Bimodal Offset
          2. 7.3.1.2.2 CDS Mode CLAMP/SAMPLE Adjust
      2. 7.3.2 Input Bias and Clamping
        1. 7.3.2.1 Sample and Hold Mode Biasing
        2. 7.3.2.2 CDS Mode Biasing
        3. 7.3.2.3 VCLP DAC
      3. 7.3.3 Programmable Gain
        1. 7.3.3.1 CDS/SH Stage Gain
        2. 7.3.3.2 PGA Gain Plots
      4. 7.3.4 Programmable Analog Offset Correction
      5. 7.3.5 Analog to Digital Converter
      6. 7.3.6 LVDS Output
        1. 7.3.6.1 LVDS Output Voltage
        2. 7.3.6.2 LVDS Output Modes
        3. 7.3.6.3 TXFRM Output
          1. 7.3.6.3.1 Output Mode 1 - Dual Lane
          2. 7.3.6.3.2 Output Mode 2 - Quad Lane
      7. 7.3.7 Clock Receiver
      8. 7.3.8 Power Trimming
    4. 7.4 Device Functional Mode
      1. 7.4.1 Powerdown Modes
      2. 7.4.2 LVDS Test Modes
        1. 7.4.2.1 Test Mode 0 - Fixed Pattern
        2. 7.4.2.2 Test Mode 1 - Horizontal Gradient
        3. 7.4.2.3 Test Mode 2 - Vertical Gradient
        4. 7.4.2.4 Test Mode 3 - Lattice Pattern
        5. 7.4.2.5 Test Mode 4 - Stripe Pattern
        6. 7.4.2.6 Test Mode 5 - LVDS Test Pattern (Synchronous)
        7. 7.4.2.7 Test Mode 6 - LVDS Test Pattern (Asynchronous)
        8. 7.4.2.8 Pseudo Random Number Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Writing to the Serial Registers
      3. 7.5.3 Reading the Serial Registers
      4. 7.5.4 Serial Interface Timing Details
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Total Ionizing Dose
      2. 8.1.2 Single Event Latch-Up and Functional Interrupt
      3. 8.1.3 Single Event Effects
    2. 8.2 Typical Application
      1. 8.2.1 Sample/Hold Mode
    3. 8.3 Initialization Set Up
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power Planes
      2. 9.1.2 Bypass Capacitors
      3. 9.1.3 Ground Plane
      4. 9.1.4 Thermal Management
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 开发支持
        1. 10.1.1.1 评估板
        2. 10.1.1.2 寄存器编程软件
    2. 10.2 接收文档更新通知
    3. 10.3 社区资源
    4. 10.4 出口管制提示
    5. 10.5 商标
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11机械、封装和可订购信息
    1. 11.1 工程样片

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NBB|68
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1.4 Thermal Management

The exposed pad on bottom of the package is attached to the back of the die to act as a heat sink. Connecting this pad to the PCB ground planes with a low thermal resistance path is the best way to remove heat from the AFE. This pad should also be connected to the ground planes through low impedance path for electrical purposes.
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