ZHCSUW0D March   1998  – February 2024 LMC660 , LMC662

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC662
    5. 5.5 Thermal Information LMC660
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Bias Current Testing
    2. 6.2 Typical Applications
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout for High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3.     Trademarks
    4. 7.3 静电放电警告
    5. 7.4 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage, VS = (V+) – (V–) Single supply 4.75 15.5 V
Dual supply ±2.375 ±7.75
Temperature range, TJ LMC66xAI –40 85 °C
LMC66xC 0 70
Power dissipation See(1)
(1) For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with PD = (TJ – TA) / θJA.
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