over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
|
Differential input voltage |
|
±Supply voltage |
V |
| VS |
Supply voltage, VS = (V+) – (V–) |
|
11 |
V |
|
Voltage at input/output pin |
(V–) – 0.3 |
(V+) + 0.3 |
V |
|
Current at input pin |
|
±5 |
mA |
| ISC |
Output short circuit(2) |
|
±30 |
mA |
|
Supply pin current |
|
30 |
mA |
|
Lead temperature (soldering, 10s) |
|
260 |
°C |
| Tstg |
Storage temperature |
–65 |
150 |
°C |
| TJ |
Junction temperature(3) |
|
150 |
°C |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Applies to both single-supply and split-supply operation. Continuous short operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature at 150°C.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly into a printed circuit board (PCB).