ZHCSNW8A October 2022 – December 2022 LMG2610
PRODUCTION DATA
The turn-on slew rate of both the low-side and high-side GaN power FETs are individually programmed to one of four discrete settings. The low-side slew rate is programmed by the resistance between the RDRVL and AGND pins. The high-side slew rate is programmed by the resistance between the RDRVH and SW pins. The low-side slew-rate setting is determined one time during AUX power up when the AUX voltage goes above the AUX Power-On Reset voltage. The high-side slew-rate setting is determined one time during BST-to-SW power up when the BST-to-SW voltage goes above the BST Power-On Reset voltage. The slew-rate setting determination time is not specified but is around 0.4 us.
Table 8-1 shows the recommended typical resistance programming value for the four slew rate settings and the typical turn-on slew rate at each setting. As noted in the table, an open-circuit connection is acceptable for programming slew-rate setting 0 and a short-circuit connection (RDRVL shorted to AGND for the low-side turn-on slew rate) (RDRVH shorted to SW for the high-side turn-on slew rate) is acceptable for programming slew-rate setting 3.
Turn-On Slew Rate Setting | Recommended Typical Programming Resistance (kΩ) |
Typical LS / HS Turn-On Slew Rate (V/ns) |
Comment |
---|---|---|---|
0 | 120 | 20 / 20 | Open-circuit connection for programming resistance is acceptable. |
1 | 47 | 50 / 65 | |
2 | 22 | 70 / 90 | |
3 | 5.6 | 140 / 165 | Short-circuit connection for programming resistance (RDRVL shorted to AGND for low-side slew rate) (RDRVH shorted to SW for high-side slew rate) is acceptable. |