SNLS285H April   2008  – May 2016 LMH0303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - DC
    6. 6.6 Electrical Characteristics - AC
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Loss-of-Signal Detector
      2. 7.3.2 Input Interfacing
      3. 7.3.3 Output Interfacing
      4. 7.3.4 Output Slew Rate Control
      5. 7.3.5 Cable Fault Detection
      6. 7.3.6 SMBus Interface
        1. 7.3.6.1 Transfer of Data through the SMBus
        2. 7.3.6.2 SMBus Transactions
          1. 7.3.6.2.1 Writing a Register
          2. 7.3.6.2.2 Reading a Register
        3. 7.3.6.3 Communicating With Multiple LMH0303 Cable Drivers through the SMBus
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
      2. 8.1.2 Cable Fault Detection Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from G Revision (April 2013) to H Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from F Revision (April 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo
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