ZHCSDJ6E February   2015  – June 2018 LMH1218

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化 SPI 电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions – SPI Mode/ Mode_SEL = 1 kΩ to VDD
    2.     Pin Descriptions – SMBUS Mode/ MODE_SEL = 1 kΩ to GND
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Loss of Signal Detector
      2. 7.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 7.3.3 2:1 Multiplexer
      4. 7.3.4 Clock and Data Recovery
      5. 7.3.5 Eye Opening Monitor (EOM)
      6. 7.3.6 Fast EOM
        1. 7.3.6.1 SMBus Fast EOM Operation
        2. 7.3.6.2 SPI Fast EOM Operation
      7. 7.3.7 LMH1218 Device Configuration
        1. 7.3.7.1 MODE_SEL
        2. 7.3.7.2 ENABLE
        3. 7.3.7.3 LOS_INT_N
        4. 7.3.7.4 LOCK
        5. 7.3.7.5 SMBus MODE
        6. 7.3.7.6 SMBus READ/WRITE Transaction
        7. 7.3.7.7 SPI Mode
          1. 7.3.7.7.1 SPI READ/WRITE Transaction
          2. 7.3.7.7.2 SPI Write Transaction Format
          3. 7.3.7.7.3 SPI Read Transaction Format
        8. 7.3.7.8 SPI Daisy Chain
          1. 7.3.7.8.1 SPI Daisy Chain Write Example
          2. 7.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 7.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 7.3.8 Power-On Reset
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 Global Registers
      2. 7.6.2 Receiver Registers
      3. 7.6.3 CDR Registers
      4. 7.6.4 Transmitter Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Initialization Set Up
      1. 8.4.1 Selective Data Rate Lock
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Solder Profile
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications(1)(2)

Over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f SCK SCK frequency MODE_SEL = 1 10 20 MHz
TSCK SCK period 50 ns
tPH SCK pulse width high 0.4 × TSCK ns
tPL SCK pulse width low 0.4 × TSCK ns
tSU MOSI setup time 4 4 ns
tH MOSI hold time 4 4 ns
tSSSu SS_N setup time 14 18 ns
tSSH SS_N hold time 4 4 ns
tSSOF SS_N off time 1 μs
tODZ MISO driven to TRI-STATE time 20 ns
tOZD MISO TRI-STATE-to-Driven time 10 ns
tOD MISO output delay time 15 ns
(1) Typical values are parametric norms at VDD = 2.5 V, TA = 25ºC, and recommended operating conditions at the time of product characterization. Typical values are not production tested.
(2) These specifications support SPI 1.0 specifications.
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