ZHCSDJ6E February   2015  – June 2018 LMH1218

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化 SPI 电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions – SPI Mode/ Mode_SEL = 1 kΩ to VDD
    2.     Pin Descriptions – SMBUS Mode/ MODE_SEL = 1 kΩ to GND
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Loss of Signal Detector
      2. 7.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 7.3.3 2:1 Multiplexer
      4. 7.3.4 Clock and Data Recovery
      5. 7.3.5 Eye Opening Monitor (EOM)
      6. 7.3.6 Fast EOM
        1. 7.3.6.1 SMBus Fast EOM Operation
        2. 7.3.6.2 SPI Fast EOM Operation
      7. 7.3.7 LMH1218 Device Configuration
        1. 7.3.7.1 MODE_SEL
        2. 7.3.7.2 ENABLE
        3. 7.3.7.3 LOS_INT_N
        4. 7.3.7.4 LOCK
        5. 7.3.7.5 SMBus MODE
        6. 7.3.7.6 SMBus READ/WRITE Transaction
        7. 7.3.7.7 SPI Mode
          1. 7.3.7.7.1 SPI READ/WRITE Transaction
          2. 7.3.7.7.2 SPI Write Transaction Format
          3. 7.3.7.7.3 SPI Read Transaction Format
        8. 7.3.7.8 SPI Daisy Chain
          1. 7.3.7.8.1 SPI Daisy Chain Write Example
          2. 7.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 7.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 7.3.8 Power-On Reset
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 Global Registers
      2. 7.6.2 Receiver Registers
      3. 7.6.3 CDR Registers
      4. 7.6.4 Transmitter Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Initialization Set Up
      1. 8.4.1 Selective Data Rate Lock
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Solder Profile
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 Initialization Set Up

After power up or register reset write the initialization sequences in Table 10.

Table 10. LMH1218 Register Initialization

DESCRIPTION ADDRESS [Hex] VALUE [Hex]
Enable Channel Registers 0xFF 0x04
Enable Full Temperature Range 0x16 0x25
Initialize CDR State Machine Control 0x3E 0x00
0x55 0x02
0x6A 0x00
Restore media CTLE setting(1) 0x03 xx
Reset CDR 0x0A 0x5C
Release Reset 0x0A 0x50
(1) Refer to LMH1218 Programming Guide (SNLU174) on how to quickly select the most appropriate CTLE boost setting.
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