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SNWS022D January 2010 – June 2015 LMH2110

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
Supply voltage	V_BAT – GND		5.5	V
RF input	Input power		12	dBm
RF input	DC voltage		1	V
Enable input voltage		GND – 0.4 < V_EN and V_EN< Min (V_DD – 0.4 V, 3.6 V)
Junction temperature⁽³⁾			150	°C
Maximum lead temperature (Soldering,10 sec)			260	°C
Storage temperature, T_stg		−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

(3) The maximum power dissipation is a function of T_J(MAX), R_θJA. The maximum allowable power dissipation at any ambient temperature is P_D = (T_J(MAX) – T_A)/R_θJA. All numbers apply for packages soldered directly into a PC board.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
		Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000
		Machine Model	±200

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Supply voltage	2.7	5	V
Operating temperature	−40	85	°C
RF frequency	50	8000	MHz
RF input power	−40	5	dBm

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMH2110	UNIT
		YFQ (DSBGA)
		6 PINS
R_θJA	Junction-to-ambient thermal resistance	133.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	1.7	°C/W
R_θJB	Junction-to-board thermal resistance	22.6	°C/W
ψ_JT	Junction-to-top characterization parameter	5.7	°C/W
ψ_JB	Junction-to-board characterization parameter	22.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 2.7-V and 4.5-V DC and AC Electrical Characteristics

Unless otherwise specified: all limits are ensured to T_A = 25°C, V_BAT = 2.7 V and 4.5 V (worst of the 2 is specified),
RF_IN = 1900 MHz CW (Continuous Wave, unmodulated).⁽¹⁾

PARAMETER		TEST CONDITIONS		MIN⁽²⁾	TYP⁽³⁾	MAX⁽²⁾	UNIT
SUPPLY INTERFACE
I_BAT	Supply current	Active mode: EN = HIGH, no signal present at RF_IN		3.7	4.8	5.5	mA
		Active mode: EN = HIGH, no signal present at RF_IN Limits apply at temperature extremes.		2.9		5.9	mA
		Shutdown: EN = LOW, no signal present at RF_IN.	V_BAT = 2.7 V		3.7	4.7	μA
		Shutdown: EN = LOW, no signal present at RF_IN.	V_BAT = 4.5 V		4.6	5.7	μA
		Shutdown: EN = LOW, no signal present at RF_IN. Limits apply at temperature extremes.	V_BAT = 2.7 V			5	μA
			V_BAT = 4.5 V			6.1	μA
		EN = Low, RF_IN = 0 dBm, 1900 MHz	V_BAT = 2.7V		3.5	4.7	μA
		EN = Low, RF_IN = 0 dBm, 1900 MHz	V_BAT = 4.5 V		4.6	5.7	μA
		EN = Low, RF_IN = 0 dBm, 1900 MHz Limits apply at temperature extremes.	V_BAT = 2.7 V			5	μA
			V_BAT = 4.5 V			6.1	μA
PSRR	Power Supply Rejection Ratio⁽⁴⁾	RF_IN = −10 dBm, 1900 MHz, 2.7V < V_BAT < 5 V			56		dB
PSRR	Power Supply Rejection Ratio⁽⁴⁾	RF_IN = −10 dBm, 1900 MHz, 2.7V < V_BAT < 5 V Limits apply at temperature extremes.		45			dB
LOGIC ENABLE INTERFACE
V_LOW	EN logic low input level (Shutdown mode)	Limits apply at temperature extremes.				0.6	V
V_HIGH	EN logic high input level	Limits apply at temperature extremes.		1.1			V
I_EN	Current into EN pin	Limits apply at temperature extremes.				50	nA
INPUT/OUTPUT INTERFACE
R_IN	Input resistance			44	50	56	Ω
V_OUT	Minimum output voltage (pedestal)	No input signal			1.5		mV
V_OUT	Minimum output voltage (pedestal)	No input signal, limits apply at temperature extremes		0		8	mV
R_OUT	Output impedance	EN = High, RF_IN = –10 dBm, 1900 MHz, I_LOAD = 1 mA, DC measurement			0.2	2	Ω
R_OUT	Output impedance	EN = High, RF_IN = –10 dBm, 1900 MHz, I_LOAD = 1 mA, DC measurement, limits apply at temperature extremes.				3	Ω
I_OUT	Output short circuit current	Sinking, RF_IN = –10 dBm, OUT connected to 2.5 V		37	42		mA
		Sinking, RF_IN = –10 dBm, OUT connected to 2.5 V Limits apply at temperature extremes.		32
		Sourcing, RF_IN = –10 dBm, OUT connected to GND		40	46
		Sourcing, RF_IN = –10 dBm, OUT connected to GND Limits apply at temperature extremes.		34
I_OUT,SD	Output leakage current in shutdown mode	EN = Low, OUT connected to 2 V Limits apply at temperature extremes.				50	nA
e_n	Output referred noise⁽⁴⁾	RF_IN = −10 dBm, 1900 MHz, output spectrum at 10 kHz			3		µV√Hz
V_N	Integrated output referred noise⁽⁴⁾	Integrated over frequency band 1 kHz – 6.5 kHz, RF_IN = –10 dBm, 1900 MHz			210		µV_RMS
RF DETECTOR TRANSFER RF_IN = 50 MHz (fit range –20 dBm to –10 dBm)⁽⁵⁾
P_MIN	Minimum power level, bottom end of dynamic range	Log conformance error within ±1 dB			–39		dBm
P_MAX	Maximum power level, top end of dynamic range	Log conformance error within ±1 dB			7		dBm
V_MIN	Minimum output voltage	At P_MIN			3		mV
V_MAX	Maximum output voltage	At P_MAX			1.96		V
K_SLOPE	Logarithmic slope			42.2	44.3	46.4	mV/dB
P_INT	Logarithmic Intercept			–38.6	–38.3	–38.0	dBm
DR	Dynamic Range for specified accuracy	±1-dB Log conformance error (E_LC)			46		dB
		±1-dB Log conformance error (E_LC) Limits apply at temperature extremes.			45
		±3-dB Log Conformance Error (E_LC)			51
		±3-dB Log conformance error (E_LC) Limits apply at temperature extremes.			50
		±0.5-dB input referred variation over temperature (E_VOT), from P_MIN Limits apply at temperature extremes.			42
RF DETECTOR TRANSFER RF_IN = 900 MHz (fit range –20 dBm to –10 dBm)⁽⁵⁾
P_MIN	Minimum power level, bottom end of dynamic range	Log conformance error within ±1 dB			–38		dBm
P_MAX	Maximum power level, top end of dynamic range	Log conformance error within ±1 dB			0		dBm
V_MIN	Minimum output voltage	At P_MIN			3		mV
V_MAX	Maximum output voltage	At P_MAX			1.58		V
K_SLOPE	Logarithmic slope			41.8	43.9	46	mV/dB
P_INT	Logarithmic intercept			–37.4	–37	–36.7	dBm
DR	Dynamic range for specified accuracy	±1-dB Log conformance error (E_LC)			38		dB
		±1-dB Log conformance error (E_LC) Limits apply at temperature extremes.			37
		±3-dB Log conformance error (E_LC)			45
		±3-dB Log conformance error (E_LC) Limits apply at temperature extremes.			44
		±0.5-dB Input referred variation over temperature (E_VOT), from P_MIN Limits apply at temperature extremes.			44
		±0.3-dB Error for a 1dB Step (E1dB STEP)			41
		±0.3-dB Error for a 1dB Step (E1dB STEP) Limits apply at temperature extremes.			38
		±1-dB Error for a 10dB Step (E10dB 30 STEP) Limits apply at temperature extremes.			32
E_MOD	Input-referred variation due to modulation	W-CDMA Release 6/7/8, –38 dBm < RF_IN < –5 dBm			0.08		dB
		LTE, –38 dBm < RF_IN < –5 dBm			0.19		dB
RF DETECTOR TRANSFER RF_IN = 1900 MHz (fit range –20 dBm to –10 dBm)⁽⁵⁾
P_MIN	Minimum power level, bottom end of dynamic range	Log conformance error within ±1 dB			–36		dBm
P_MAX	Maximum power level, top end of dynamic range	Log conformance error within ±1 dB			0		dBm
V_MIN	Minimum output voltage	At P_MIN			3		mV
V_MAX	maximum output voltage	At P_MAX			1.5		V
K_SLOPE	Logarithmic slope			41.8	43.9	46.1	mV/dB
P_INT	Logarithmic Intercept			–35.5	–35.1	–34.7	dBm
DR	Dynamic range for specified accuracy	±1-dB Log conformance error (E_LC) Limits apply at temperature extremes.			36		dB
		±3-dB Log conformance Error (E_LC)			45
		±3-dB Log conformance error (E_LC) Limits apply at temperature extremes.			43
		±0.5-dB Input referred variation over temperature (E_VOT), from P_MIN Limits apply at temperature extremes.			41
		±0.3-dB error for a 1-dB Step (E1dB STEP)			40
		±0.3-dB error for a 1-dB Step (E1dB STEP) Limits apply at temperature extremes.			38
		±1-dB error for a 10-dB Step (E10-dB 30 STEP) Limits apply at temperature extremes.			30
E_MOD	Input-referred variation due to modulation	W-CDMA Release 6/7/8, –38 dBm < RF_IN < –5 dBm			0.09		dB
E_MOD	Input-referred variation due to modulation	LTE, –38 dBm < RF_IN < –5 dBm			0.18		dB
RF_IN = 3500 MHz, fit range –15 dBm to –5 dBm⁽⁵⁾
P_MIN	Minimum power level, bottom end of dynamic range	Log conformance error within ±1 dB			–31		dBm
P_MAX	Maximum power level, top end of dynamic range	Log conformance error within ±1 dB			6		dBm
V_MIN	Minimum output voltage	At P_MIN			2		mV
V_MAX	Maximum output voltage	At P_MAX			1.52		V
K_SLOPE	Logarithmic slope			41.8	44	46.1	mV/dB
P_INT	Logarithmic Intercept			–30.5	–29.7	–28.8	dBm
DR	Dynamic range for specified accuracy	±1-dB Log conformance error (E_LC)			37		dB
		±1-dB Log conformance error (E_LC) Limits apply at temperature extremes.			36
		±3-dB Log conformance error (E_LC)			44
		±3-dB Log conformance error (E_LC) Limits apply at temperature extremes.			42
		±0.5-dB Input referred variation over temperature (E_VOT), from P_MIN Limits apply at temperature extremes.			39
RF_IN = 5800 MHz, fit range –20 dBm to 3 dBm⁽⁵⁾
P_MIN	Minimum power level, bottom end of dynamic range	Log conformance error within ±1 dB			–22		dBm
P_MAX	Maximum power level, top end of dynamic range	Log conformance error within ±1 dB			10		dBm
V_MIN	Minimum output voltage	At P_MIN			3		mV
V_MAX	Maximum output voltage	At P_MAX			1.34		V
K_SLOPE	Logarithmic slope			42.5	44.8	47.1	mV/dB
P_INT	Logarithmic Intercept			–22	–21	–19.9	dBm
DR	Dynamic range for specified accuracy	±1-dB Log conformance error (E_LC)			32		dB
		±1-dB Log conformance error (E_LC) Limits apply at temperature extremes.			31
		±3-dB Log conformance error (E_LC)			39
		±3-dB Log conformance error (E_LC) Limits apply at temperature extremes.			37
		±0.5-dB Input referred variation over temperature (E_VOT), from P_MIN Limits apply at temperature extremes.			33

(1) 2.7-V and 4.5-V DC and AC Electrical Characteristics values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that T_J = T_A. Parametric performance is not ensured in the 2.7-V and 4.5-V DC and AC Electrical Characteristics under conditions of internal self-heating where T_J > T_A.

(2) All limits are specified by test or statistical analysis.

(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.

(4) This parameter is specified by design and/or characterization and is not tested in production.

(5) All limits are specified by design and measurements which are performed on a limited number of samples. Limits represent the mean ±3–sigma values. The typical value represents the statistical mean value.

6.6 Timing Requirements

		NOM	MAX	UNIT
t_ON	Turnon time from shutdown RF_IN = –10 dBm, 1900 MHz, EN LOW-HIGH transition to OUT at 90%	15	19	µs
t_R	Rise time⁽¹⁾ Signal at RF_IN from –20 dBm to 0 dBm, 10% to 90%, 1900 MHz	2.2		µs
t_F	Fall time ⁽¹⁾ Signal at RF_IN from 0 dBm to –20 dBm, 90% to 10%, 1900 MHz	31		µs

(1) This parameter is specified by design and/or characterization and is not tested in production.

6.7 Typical Characteristics

Unless otherwise specified: T_A = 25°C, V_BAT = 2.7 V, RF_IN = 1900 MHz CW (Continuous Wave, unmodulated). Specified errors are input referred.

Figure 1. Supply Current vs. Supply Voltage (Active)

Figure 3. Supply Current vs. Enable Voltage (EN)

Figure 5. Sourcing Output Current vs. RF Input Power

Figure 7. RF Input Impedance vs. Frequency,
Resistance (R) and Reactance (X)

Figure 9. Output Voltage Noise vs. Frequency

Figure 11. Log Intercept vs. Frequency

Figure 13. Log Conformance Error (50 Units) vs.
RF Input Power at 50 MHz

Figure 15. Temperature Variation (50 Units) vs.
RF Input Power at 50 MHz

Figure 17. Log Conformance Error (50 Units) vs.
RF Input Power at 900 MHz

Figure 19. Temperature Variation (50 Units) vs.
RF Input Power at 900 MHz

Figure 21. 10 dB Power Step Error vs.
RF Input Power at 900 MHz

Figure 23. LTE Variation vs.
RF Input Power at 900 MHz

Figure 25. Log Conformance Error (50 Units) vs.
RF Input Power at 1900 MHz

Figure 27. Temperature Variation (50 Units) vs.
RF Input Power at 1900 MHz

Figure 29. 10-dB Power Step Error vs.
RF Input Power at 1900 MHz

Figure 31. LTE Input referred Variation vs.
RF Input Power at 1900 MHz

Figure 33. Log Conformance Error (50 Units) vs.
RF Input Power at 3500 MHz

Figure 35. Temperature Variation (50 Units) vs.
RF Input Power at 3500 MHz

Figure 37. Log Conformance Error (50 Units) vs.
RF Input Power at 5800 MHz

Figure 39. Temperature Variation (50 Units) vs.
RF Input Power at 5800 MHz

Figure 41. Temperature Variation vs.
RF Input Power at 8000 MHz

Figure 2. Supply Current vs. Supply Voltage (Shutdown)

Figure 4. Supply Current vs. RF Input Power

Figure 6. Sinking Output Current vs. RF Input Power

Figure 8. Power Supply Rejection Ratio vs. Frequency

Figure 10. Log Slope vs. Frequency

Figure 12. Output Voltage and Log Conformance Error vs.
RF Input Power at 50 MHz

Figure 14. Temperature Variation vs.
RF Input Power at 50 MHz

Figure 16. Output Voltage and Log Conformance Error vs.
RF Input Power at 900 MHz

Figure 18. Temperature Variation vs.
RF Input Power at 900 MHz

Figure 20. 1-dB Power Step Error vs.
RF Input Power at 900 MHz

Figure 22. W-CDMA Variation vs.
RF Input Power at 900 MHz

Figure 24. Output Voltage and Log Conformance Error vs.
RF Input Power at 1900 MHz

Figure 26. Temperature Variation vs.
RF Input Power at 1900 MHz

Figure 28. 1-dB Power Step Error vs.
RF Input Power at 1900 MHz

Figure 30. W-CDMA Variation vs.
RF Input Power at 1900 MHz

Figure 32. Output Voltage and Log Conformance Error vs.
RF Input Power at 3500 MHz

Figure 34. Temperature Variation vs.
RF Input Power at 3500 MHz

Figure 36. Output Voltage and Log Conformance Error vs.
RF Input Power at 5800 MHz

Figure 38. Temperature Variation vs.
RF Input Power at 5800 MHz

Figure 40. Output Voltage and Log Conformance Error vs.
RF Input Power at 8000 MHz