ZHCSF77A July   2016  – July 2016 LMH2832

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: SPI
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Setup Diagrams
    2. 8.2 ATE Testing and DC Measurements
    3. 8.3 Frequency Response
    4. 8.4 Distortion
    5. 8.5 Noise Figure
    6. 8.6 Pulse Response, Slew Rate, and Overdrive Recovery
    7. 8.7 Power-Down
    8. 8.8 Crosstalk, Gain Matching, and Phase Matching
    9. 8.9 Output Measurement Reference Points
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input Characteristics
      2. 9.3.2 Analog Output Characteristics
      3. 9.3.3 Driving Low Insertion-Loss Filters
      4. 9.3.4 Input Impedance Matching
      5. 9.3.5 Power-On Reset (POR)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down (PD)
      2. 9.4.2 Gain Control
    5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 SW Reset Register (address = 2)
      2. 9.6.2 Power-Down Control Register (address = 3)
      3. 9.6.3 Channel A RW0 Register (address = 4)
      4. 9.6.4 Channel A RW1 Register (address = 5)
      5. 9.6.5 Channel B RW0 Register (address = 6)
      6. 9.6.6 Channel B RW1 Register (address = 7)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving ADCs
        1. 10.1.1.1 SNR Considerations
        2. 10.1.1.2 SFDR Considerations
        3. 10.1.1.3 ADC Input Common-Mode Voltage Considerations (AC-Coupled Input)
        4. 10.1.1.4 ADC Input Common-Mode Voltage Considerations (DC-Coupled Input)
    2. 10.2 Typical Applications
      1. 10.2.1 DOCSIS 3.X Driver
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Source Resistance Matching
          2. 10.2.1.2.2 Output Impedance Matching
          3. 10.2.1.2.3 Voltage Headroom Considerations
        3. 10.2.1.3 Application Curve
      2. 10.2.2 IQ Receiver
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power Supply Recommendations
    1. 11.1 Split Supplies
    2. 11.2 Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 器件命名规则
    2. 13.2 文档支持
      1. 13.2.1 相关文档　
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
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