ZHCSKC6D October   2019  – January 2023 LMH32401

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Gain = 2 kΩ
    6. 6.6 Electrical Characteristics: Gain = 20 kΩ
    7. 6.7 Electrical Characteristics: Both Gains
    8. 6.8 Electrical Characteristics: Logic Threshold and Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switched Gain Transimpedance Amplifier
      2. 7.3.2 Clamping and Input Protection
      3. 7.3.3 ESD Protection
      4. 7.3.4 Differential Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ambient Light Cancellation (ALC) Mode
      2. 7.4.2 Power-Down Mode (Multiplexer Mode)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGT|16
  • Y|0
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (August 2022) to Revision D (January 2023)

  • Updated the backside potential information for bare die package information in the Pin Configuration and Functions section Go

Changes from Revision B (February 2022) to Revision C (August 2022)

  • 将裸片的状态从预发布 更改为正在供货 Go
  • Updated the bare die package information in the Pin Configuration and Functions sectionGo

Changes from Revision A (September 2020) to Revision B (February 2022)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 向特性 部分和器件信息 表添加了裸片预发布封装 Go
  • Added the bare die preview package to the Pin Configuration and Functions sectionGo

Changes from Revision * (October 2019) to Revision A (June 2020)

  • 将状态从“预告信息”更改为“量产数据”Go
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