ZHCSKC6D October 2019 – January 2023 LMH32401
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | LMH32401(2) | UNIT | |
|---|---|---|---|
| RGT (VQFN) | |||
| 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 56.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67 | °C/W |
| RθJB | Junction-to-board thermal resistance | 31.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 3.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 31.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 15.6 | °C/W |