ZHCSCW7D October   2014  – February 2018 LMH5401

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     失真与频率间的关系（G = 12dB，SE-DE，RL = 200Ω，VPP = 2V）
  3. 3 说明
    1.     驱动 ADC12J4000 的 LMH5401
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 5 V
    6. 6.6 Electrical Characteristics: VS = 3.3 V
    7. 6.7 Typical Characteristics: 5 V
    8. 6.8 Typical Characteristics: 3.3 V
    9. 6.9 Typical Characteristics: 3.3-V to 5-V Supply Range
  7. 7 Parameter Measurement Information
    1. 7.1  Output Reference Points
    2. 7.2  ATE Testing and DC Measurements
    3. 7.3  Frequency Response
    4. 7.4  S-Parameters
    5. 7.5  Frequency Response with Capacitive Load
    6. 7.6  Distortion
    7. 7.7  Noise Figure
    8. 7.8  Pulse Response, Slew Rate, and Overdrive Recovery
    9. 7.9  Power Down
    10. 7.10 VCM Frequency Response
    11. 7.11 Test Schematics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully-Differential Amplifier
        1. 8.3.1.1 Power Down and Ground Pins
      2. 8.3.2 Operations for Single-Ended to Differential Signals
        1. 8.3.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 8.3.2.2 DC-Coupled Input Signal Path Considerations for SE-DE Conversions
        3. 8.3.2.3 Resistor Design Equations for Single-to-Differential Applications
        4. 8.3.2.4 Input Impedance Calculations
      3. 8.3.3 Differential-to-Differential Signals
        1. 8.3.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 8.3.3.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
      4. 8.3.4 Output Common-Mode Voltage
      5. 8.3.5 LMH5401 Comparison
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With a Split Supply
      2. 8.4.2 Operation With a Single Supply
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Stability
      2. 9.1.2 Input and Output Headroom Considerations
      3. 9.1.3 Noise Analysis
      4. 9.1.4 Noise Figure
      5. 9.1.5 Thermal Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Driving Matched Loads
        2. 9.2.2.2 Driving Unmatched Loads For Lower Loss
        3. 9.2.2.3 Driving Capacitive Loads
        4. 9.2.2.4 Driving ADCs
          1. 9.2.2.4.1 SNR Considerations
          2. 9.2.2.4.2 SFDR Considerations
          3. 9.2.2.4.3 ADC Input Common-Mode Voltage Considerations : AC-Coupled Input
          4. 9.2.2.4.4 ADC Input Common-Mode Voltage Considerations : DC-Coupled Input
        5. 9.2.2.5 GSPS ADC Driver
        6. 9.2.2.6 Common-Mode Voltage Correction
        7. 9.2.2.7 Active Balun
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Do:
      2. 9.3.2 Don't:
  10. 10Power Supply Recommendations
    1. 10.1 Supply Voltage
    2. 10.2 Single-Supply
    3. 10.3 Split-Supply
    4. 10.4 Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件命名规则
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) LMH5401 UNIT
RMS (UQFN)
14 PINS
RθJA Junction-to-ambient thermal resistance 101 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 °C/W
RθJB Junction-to-board thermal resistance 61 °C/W
ψJT Junction-to-top characterization parameter 4.2 °C/W
ψJB Junction-to-board characterization parameter 61 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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