ZHCSOM5D April 2006 – September 2021 LMH6321
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC1 | LMH6321 | UNIT | ||
|---|---|---|---|---|
| DDA SO Power Pad | DDAPAK | |||
| 8 Pins | 7 Pins | |||
| R θJA | Junction-to-ambient thermal resistance | 37.8 | 21.5 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 51.6 | 34.4 | °C/W |
| R θJB | Junction-to-board thermal resistance | 11.7 | 6.7 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 2.5 | 3.2 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 11.7 | 6.3 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 3.6 | 1.1 | °C/W |