SNOSB30P October   2008  – January 2015 LMH6554

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: +5 V
    6. 7.6 Typical Performance Characteristics VS = ±2.5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Ended Input to Differential Output Operation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Enable / Disable Operation
          2. 9.2.1.2.2 Single-Ended Input to Differential Output Operation
          3. 9.2.1.2.3 Driving Capacitive Loads
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fully Differential Operation
      3. 9.2.3 Single Supply Operation
      4. 9.2.4 Driving Analog-to-Digital Converters
      5. 9.2.5 Output Noise Performance and Measurement
      6. 9.2.6 Balanced Cable Driver
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Bypassing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 ESD Protection
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from O Revision (March 2013) to P Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from N Revision (March 2013) to O Revision

  • Changed layout of National Data Sheet to TI formatGo
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