SNOSAK9F June   2006  – June 2015 LMH6601 , LMH6601-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - for LMH6601
    3. 6.3  ESD Ratings - for LMH6601-Q1
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.7 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.7 V
    12. 6.12 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Shutdown Capability and Turn On/Off Behavior
      2. 7.2.2 Overload Recovery and Swing Close to Rails
    3. 7.3 Device Functional Modes
      1. 7.3.1 Optimizing Performance
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DC-Coupled, Single-Supply Baseband Video Amplifier and Driver
      2. 8.1.2 How to Pick the Right Video Amplifier
      3. 8.1.3 Current to Voltage Conversion (Transimpedance Amplifier (TIA)
      4. 8.1.4 Transimpedance Amplifier Noise Considerations
      5. 8.1.5 Charge Preamplifier
      6. 8.1.6 Capacitive Load
    2. 8.2 Typical Application
      1. 8.2.1 SAG Compensation for AC-Coupled Video
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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9 Power Supply Recommendations

The LMH6601 can operate off a single-supply or with dual supplies. The input CM capability of the parts (CMVR) extends all the way down to the V- rail to simplify single-supply applications. Supplies should be decoupled with low-inductance, often ceramic, capacitors to ground less than 0.5 inches from the device pins. TI recommends the use of ground plane, and as in most high-speed devices, it is advisable to remove ground plane close to device sensitive pins such as the inputs.