ZHCSDC9D August   2012  – February 2015 LMH6882

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Single-Ended Input
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Digital Control of the Gain and Power-Down Pins
      2. 7.5.2 Parallel Interface
      3. 7.5.3 SPI-Compatible Serial Interface
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Characteristics
      2. 8.1.2 Output Characteristics
      3. 8.1.3 Interfacing to an ADC
        1. 8.1.3.1 ADC Noise Filter
        2. 8.1.3.2 AC Coupling to an ADC
        3. 8.1.3.3 DC Coupling to an ADC
      4. 8.1.4 Figure of Merit: Dynamic Range Figure
    2. 8.2 Typical Applications
      1. 8.2.1 LMH6882 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LMH6882 Used as Twisted Pair Cable Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Uncontrolled Impedance Traces
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档 
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NJK|36
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (March 2013) to D Revision

  • Added 引脚配置和功能部分,ESD 额定值表,特性描述部分,器件功能模式应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from B Revision (March 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo