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ZHCSKK7 December 2019 LMH9226

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		LMH9226	UNIT
		RRL PKG
		12-PIN WQFN
R_θJA	Junction-to-ambient thermal resistance	74.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	72.4	°C/W
R_θJB	Junction-to-board thermal resistance	37.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	3.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	37.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	14.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.