ZHCSH72J september   2011  – may 2023 LMK00301

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VCC and VCCO Power Supplies
    4. 9.4 Device Functional Modes
      1. 9.4.1 Clock Inputs
      2. 9.4.2 Clock Outputs
        1. 9.4.2.1 Reference Output
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Driving the Clock Inputs
        2. 10.2.1.2 Crystal Interface
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Termination and Use of Clock Drivers
          1. 10.2.2.1.1 Termination for DC Coupled Differential Operation
          2. 10.2.2.1.2 Termination for AC Coupled Differential Operation
          3. 10.2.2.1.3 Termination for Single-Ended Operation
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
    1. 11.1 Power Supply Sequencing
    2. 11.2 Current Consumption and Power Dissipation Calculations
      1. 11.2.1 Power Dissipation Example #1: Separate VCC and VCCO Supplies with Unused Outputs
      2. 11.2.2 Power Dissipation Example #2: Worst-Case Dissipation
    3. 11.3 Power Supply Bypassing
      1. 11.3.1 Power Supply Ripple Rejection
    4. 11.4 Thermal Management
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)(2)LMK00301UNIT
RHS0048A
(WQFN)
48 PINS
RθJAJunction-to-ambient thermal resistance28.5°C/W
RθJC(top) (DAP)Junction-to-case (top) thermal resistance7.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key role in improving the thermal performance of the package. It is recommended that the maximum number of vias be used in the board layout.
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