11.1.1 Ground Planes

Solid ground planes are recommended because these planes provide a low-impedance return paths between the device and bypass capacitors, along with the clock source and destination devices.

LMK00804B-Q1 has a die attach pad (DAP) for enhanced thermal and electrical performance. Use five VIAs to connect the DAP to a solid GND plane. Full-through VIAs are preferred.

Avoid return paths of other system circuitry (for example, high-speed/digital logic, switching power supplies, and so forth) from passing through the local ground of the device to minimize noise coupling. Remember that noise coupling can lead to added jitter and spurious noise.