ZHCSHU9K September   2011  – December 2023 LMK03806

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 描述
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Differential Voltage Measurement Terminology
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Features Description
      1. 7.3.1 Serial MICROWIRE Timing Diagram and Terminology
      2. 7.3.2 Crystal Support With Buffered Outputs
      3. 7.3.3 Integrated Loop Filter Poles
      4. 7.3.4 Integrated VCO
      5. 7.3.5 Clock Distribution
        1. 7.3.5.1 CLKout DIvider
        2. 7.3.5.2 Programmable Output Type
        3. 7.3.5.3 Clock Output Synchronization
      6. 7.3.6 Default Start-Up Clocks
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 General Information
        1. 7.5.1.1 Special Programming Case for R0 to R5 for CLKoutX_Y_DIV > 25
        2. 7.5.1.2 Recommended Initial Programming Sequence
        3. 7.5.1.3 READBACK
          1. 7.5.1.3.1 Readback Example
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Crystal Interface
      2. 8.1.2 Driving OSCin Pins With a Single-Ended Source
      3. 8.1.3 Driving OSCin Pins With a Differential Source
      4. 8.1.4 Frequency Planning With the LMK03806
      5. 8.1.5 Configuring the PLL
        1. 8.1.5.1 Example PLL Configuration
      6. 8.1.6 Digital Lock Detect
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Device Selection
          1. 8.2.2.1.1 Clock Architect
          2. 8.2.2.1.2 Clock Design Tool
          3. 8.2.2.1.3 Calculation Using LCM
        2. 8.2.2.2 Device Configuration
        3. 8.2.2.3 PLL Loop Filter Design
          1. 8.2.2.3.1 Example Loop Filter Design
        4. 8.2.2.4 Other Device Specific Configuration
          1. 8.2.2.4.1 Digital Lock Detect
        5. 8.2.2.5 Device Programming
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 System Level Diagram
    4. 8.4 Best Design Practices
      1. 8.4.1 LVCMOS Complementary vs. Non-Complementary Operation
      2. 8.4.2 LVPECL Outputs
      3. 8.4.3 Sharing MICROWIRE (SPI) Lines
      4. 8.4.4 SYNC Pin
      5. 8.4.5 CLKout Vcc Pins
    5. 8.5 Power Supply Recommendations
      1. 8.5.1 Current Consumption and Power Dissipation Calculations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Register Maps
    1. 10.1  Default Device Register Settings After Power On Reset
    2. 10.2  Register R0 TO R5
      1. 10.2.1 CLKoutX_Y_PD, Powerdown CLKoutX_Y Output Path
      2. 10.2.2 RESET
      3. 10.2.3 POWERDOWN
      4. 10.2.4 CLKoutX_Y_DIV, Clock Output Divide
    3. 10.3  Registers R6 TO R8
      1. 10.3.1 CLKoutX_TYPE
    4. 10.4  REGISTER R9
    5. 10.5  REGISTER R10
      1. 10.5.1 OSCout1_TYPE, LVPECL Output Amplitude Control
      2. 10.5.2 OSCout0_TYPE
      3. 10.5.3 EN_OSCoutX, OSCout Output Enable
      4. 10.5.4 OSCoutX_MUX, Clock Output Mux
      5. 10.5.5 OSCout_DIV, Oscillator Output Divide
    6. 10.6  REGISTER R11
      1. 10.6.1 NO_SYNC_CLKoutX_Y
      2. 10.6.2 SYNC_POL_INV
      3. 10.6.3 SYNC_TYPE
      4. 10.6.4 EN_PLL_XTAL
    7. 10.7  REGISTER R12
      1. 10.7.1 LD_MUX
      2. 10.7.2 LD_TYPE
      3. 10.7.3 SYNC_PLL_DLD
    8. 10.8  REGISTER R13
      1. 10.8.1 READBACK_TYPE
      2. 10.8.2 GPout0
    9. 10.9  REGISTER 14
      1. 10.9.1 GPout1
    10. 10.10 REGISTER 16
    11. 10.11 REGISTER 24
      1. 10.11.1 PLL_C4_LF, PLL Integrated Loop Filter Component
      2. 10.11.2 PLL_C3_LF, PLL Integrated Loop Filter Component
      3. 10.11.3 PLL_R4_LF, PLL Integrated Loop Filter Component
      4. 10.11.4 PLL_R3_LF, PLL Integrated Loop Filter Component
    12. 10.12 REGISTER 26
      1. 10.12.1 EN_PLL_REF_2X, PLL Reference Frequency Doubler
      2. 10.12.2 PLL_CP_GAIN, PLL Charge Pump Current
      3. 10.12.3 PLL_DLD_CNT
    13. 10.13 REGISTER 28
      1. 10.13.1 PLL_R, PLL R Divider
    14. 10.14 REGISTER 29
      1. 10.14.1 OSCin_FREQ, PLL Oscillator Input Frequency Register
      2. 10.14.2 PLL_N_CAL, PLL N Calibration Divider
    15. 10.15 REGISTER 30
      1. 10.15.1 PLL_P, PLL N Prescaler Divider
      2. 10.15.2 PLL_N, PLL N Divider
    16. 10.16 REGISTER 31
      1. 10.16.1 READBACK_ADDR
      2. 10.16.2 uWire_LOCK
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)LMK03806UNIT
NKD (WQFN)
64 PINS
RθJAJunction-to-ambient thermal resistance on 4-layer JEDEC PCB(2)25.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance(3)6.9°C/W
RθJBJunction-to-board thermal resistance4.0°C/W
ψJTJunction-to-top characterization parameter0.1°C/W
ψJBJunction-to-board characterization parameter4.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductors and IC Package Thermal Metrics application report (SPRA953).
(2) Specification assumes 32 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC PCB. These vias play a key role in improving the thermal performance of the WQFN. Note that the JEDEC PCB is a standard thermal measurement PCB and does not represent best performance a PCB can achieve. TI recommends that the maximum number of vias be used in the board layout. R θJA is unique for each PCB.
(3) Case is defined as the DAP (die attach pad)
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