ZHCSLT2C
May 2020 – November 2022
LMK04832-SP
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
绝对最大额定值
6.2
ESD 等级
6.3
建议运行条件
6.4
热性能信息
6.5
电气特性
6.6
时序要求
6.7
Timing Diagram
6.8
典型特性
7
Parameter Measurement Information
7.1
Charge Pump Current Specification Definitions
7.1.1
Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
7.1.2
Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
7.1.3
Charge Pump Output Current Magnitude Variation vs Ambient Temperature
7.2
Differential Voltage Measurement Terminology
8
Detailed Description
8.1
Overview
8.1.1
Differences Between LMK04832-SP and LMK04832
8.1.1.1
Jitter Cleaning
8.1.1.2
JEDEC JESD204B Support
8.1.2
Clock Inputs
8.1.2.1
Inputs for PLL1
8.1.2.2
Inputs for PLL2
8.1.2.3
Inputs When Using Clock Distribution Mode
8.1.3
PLL1
8.1.3.1
Frequency Holdover
8.1.3.2
External VCXO for PLL1
8.1.4
PLL2
8.1.4.1
Internal VCOs for PLL2
8.1.4.2
External VCO Mode
8.1.5
Clock Distribution
8.1.5.1
Clock Divider
8.1.5.2
High Performance Divider Bypass Mode
8.1.5.3
SYSREF Clock Divider
8.1.5.4
Device Clock Delay
8.1.5.5
Dynamic Digital Delay
8.1.5.6
SYSREF Delay: Global and Local
8.1.5.7
Programmable Output Formats
8.1.5.8
Clock Output Synchronization
8.1.6
0-Delay
8.1.7
Status Pins
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Synchronizing PLL R Dividers
8.3.1.1
PLL1 R Divider Synchronization
8.3.1.2
PLL2 R Divider Synchronization
8.3.2
SYNC/SYSREF
8.3.3
JEDEC JESD204B
8.3.3.1
How to Enable SYSREF
8.3.3.1.1
Setup of SYSREF Example
8.3.3.1.2
SYSREF_CLR
8.3.3.2
SYSREF Modes
8.3.3.2.1
SYSREF Pulser
8.3.3.2.2
Continuous SYSREF
8.3.3.2.3
SYSREF Request
8.3.4
Digital Delay
8.3.4.1
Fixed Digital Delay
8.3.4.1.1
Fixed Digital Delay Example
8.3.4.2
Dynamic Digital Delay
8.3.4.3
Single and Multiple Dynamic Digital Delay Example
8.3.5
SYSREF to Device Clock Alignment
8.3.6
Input Clock Switching
8.3.6.1
Input Clock Switching - Manual Mode
8.3.6.2
Input Clock Switching - Pin Select Mode
8.3.6.3
Input Clock Switching - Automatic Mode
8.3.7
Digital Lock Detect
8.3.7.1
Calculating Digital Lock Detect Frequency Accuracy
8.3.8
Holdover
8.3.8.1
Enable Holdover
8.3.8.1.1
Fixed (Manual) CPout1 Holdover Mode
8.3.8.1.2
Tracked CPout1 Holdover Mode
8.3.8.2
During Holdover
8.3.8.3
Exiting Holdover
8.3.8.4
Holdover Frequency Accuracy and DAC Performance
8.3.9
PLL2 Loop Filter
8.4
Device Functional Modes
8.4.1
DUAL PLL
8.4.1.1
Dual Loop
8.4.1.2
Dual Loop With Cascaded 0-Delay
8.4.1.3
Dual Loop With Nested 0-Delay
8.4.2
Single PLL
8.4.2.1
PLL2 Single Loop
8.4.2.2
PLL2 With External VCO
8.4.3
Distribution Mode
8.5
Programming
8.5.1
Recommended Programming Sequence
8.6
Register Maps
8.6.1
Register Map for Device Programming
8.6.2
Device Register Descriptions
8.6.2.1
System Functions
8.6.2.1.1
RESET, SPI_3WIRE_DIS
8.6.2.1.2
POWERDOWN
8.6.2.1.3
ID_DEVICE_TYPE
8.6.2.1.4
ID_PROD
8.6.2.1.5
ID_MASKREV
8.6.2.1.6
ID_VNDR
8.6.2.2
(0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
8.6.2.2.1
DCLKX_Y_DIV
8.6.2.2.2
DCLKX_Y_DDLY
8.6.2.2.3
CLKoutX_Y_PD, CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKX_Y_DDLY_PD, DCLKX_Y_DDLY[9:8], DCLKX_Y_DIV[9:8]
8.6.2.2.4
CLKoutX_SRC_MUX, CLKoutX_Y_PD, DCLKX_Y_BYP, DCLKX_Y_DCC, DCLKX_Y_POL, DCLKX_Y_HS
8.6.2.2.5
CLKoutY_SRC_MUX, SCLKX_Y_PD, SCLKX_Y_DIS_MODE, SCLKX_Y_POL, SCLKX_Y_HS
8.6.2.2.6
SCLKX_Y_ADLY_EN, SCLKX_Y_ADLY
8.6.2.2.7
SCLKX_Y_DDLY
8.6.2.2.8
CLKoutY_FMT, CLKoutX_FMT
8.6.2.3
SYSREF, SYNC, and Device Config
8.6.2.3.1
VCO_MUX, OSCout_MUX, OSCout_FMT
8.6.2.3.2
SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX
8.6.2.3.3
SYSREF_DIV
8.6.2.3.4
SYSREF_DDLY
8.6.2.3.5
SYSREF_PULSE_CNT
8.6.2.3.6
PLL2_RCLK_MUX, PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
8.6.2.3.7
PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
8.6.2.3.8
DDLYdSYSREF_EN, DDLYdX_EN
8.6.2.3.9
DDLYd_STEP_CNT
8.6.2.3.10
SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
8.6.2.3.11
SYNC_DISSYSREF, SYNC_DISX
8.6.2.3.12
PLL1R_SYNC_EN, PLL1R_SYNC_SRC, PLL2R_SYNC_EN, FIN0_DIV2_EN, FIN0_INPUT_TYPE
8.6.2.4
(0x146 - 0x149) CLKin Control
8.6.2.4.1
CLKin_SEL_PIN_EN, CLKin_SEL_PIN_POL, CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
8.6.2.4.2
CLKin_SEL_AUTO_REVERT_EN, CLKin_SEL_AUTO_EN, CLKin_SEL_MANUAL, CLKin1_DEMUX, CLKin0_DEMUX
8.6.2.4.3
CLKin_SEL0_MUX, CLKin_SEL0_TYPE
8.6.2.4.4
SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
8.6.2.5
RESET_MUX, RESET_TYPE
8.6.2.6
(0x14B - 0x152) Holdover
8.6.2.6.1
LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
8.6.2.6.2
MAN_DAC
8.6.2.6.3
DAC_TRIP_LOW
8.6.2.6.4
DAC_CLK_MULT, DAC_TRIP_HIGH
8.6.2.6.5
DAC_CLK_CNTR
8.6.2.6.6
CLKin_OVERRIDE, HOLDOVER_EXIT_MODE, HOLDOVER_PLL1_DET, LOS_EXTERNAL_INPUT, HOLDOVER_VTUNE_DET, CLKin_SWITCH_CP_TRI, HOLDOVER_EN
8.6.2.6.7
HOLDOVER_DLD_CNT
8.6.2.7
(0x153 - 0x15F) PLL1 Configuration
8.6.2.7.1
CLKin0_R
8.6.2.7.2
CLKin1_R
8.6.2.7.3
CLKin2_R
8.6.2.7.4
PLL1_N
8.6.2.7.5
PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
8.6.2.7.6
PLL1_DLD_CNT
8.6.2.7.7
HOLDOVER_EXIT_NADJ
8.6.2.7.8
PLL1_LD_MUX, PLL1_LD_TYPE
8.6.2.8
(0x160 - 0x16E) PLL2 Configuration
8.6.2.8.1
PLL2_R
8.6.2.8.2
PLL2_P, OSCin_FREQ, PLL2_REF_2X_EN
8.6.2.8.3
PLL2_N_CAL
8.6.2.8.4
PLL2_N
8.6.2.8.5
PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
8.6.2.8.6
PLL2_DLD_CNT
8.6.2.8.7
PLL2_LD_MUX, PLL2_LD_TYPE
8.6.2.9
(0x16F - 0x555) Misc Registers
8.6.2.9.1
PLL2_PRE_PD, PLL2_PD, FIN0_PD
8.6.2.9.2
PLL1R_RST
8.6.2.9.3
CLR_PLL1_LD_LOST, CLR_PLL2_LD_LOST
8.6.2.9.4
RB_PLL1_LD_LOST, RB_PLL1_LD, RB_PLL2_LD_LOST, RB_PLL2_LD
8.6.2.9.5
RB_DAC_VALUE (MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
8.6.2.9.6
RB_DAC_VALUE
8.6.2.9.7
RB_HOLDOVER
8.6.2.9.8
SPI_LOCK
9
Application and Implementation
9.1
Application Information
9.1.1
Treatment of Unused Pins
9.1.2
Digital Lock Detect Frequency Accuracy
9.1.2.1
Minimum Lock Time Calculation Example
9.1.3
Driving CLKin AND OSCin Inputs
9.1.3.1
Driving CLKin and OSCin PINS With a Differential Source
9.1.3.2
Driving CLKin Pins With a Single-Ended Source
9.1.4
OSCin Doubler for Best Phase Noise Performance
9.1.5
Radiation Environments
9.1.5.1
Total Ionizing Dose
9.1.5.2
Single Event Effect
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Device Selection
9.2.2.1.1
Clock Architect
9.2.2.2
Device Configuration and Simulation
9.2.2.3
Device Programming
9.3
Power Supply Recommendations
9.3.1
Cold Sparing Considerations
9.3.1.1
Damage Prevention Details to Unpowered Device
9.3.2
Current Consumption
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Thermal Management
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
Development Support
10.1.1.1
Clock Architect
10.1.1.2
PLLatinum Sim
10.1.1.3
TICS Pro
10.2
Documentation Support
10.2.1
Related Documentation
10.3
接收文档更新通知
10.4
支持资源
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
HBE|64
MCCF006A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcslt2c_oa
zhcslt2c_pm
8.6.2.2.7
SCLKX_Y_DDLY
Table 8-25 Registers 0x106, 0x10E, 0x116, 0x11E, 0x126, 0x12E, 0x136
BIT
NAME
POR DEFAULT
DESCRIPTION
7:4
NA
0
Reserved
3:0
SCLKX_Y_DDLY
0
Set digital delay value for SYSREF clock (minimum 8)
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