米6体育平台手机版

ZHCSLS7A December 2020 – January 2022 LMK1C1106 , LMK1C1108

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK1C1106	LMK1C1108	UNIT
		PW (TSSOP)	PW(TSSOP)
		14 PINS	16 PINS
R_qJA	Junction-to-ambient thermal resistance	114.4	123.4	°C/W
R_qJC(top)	Junction-to-case (top) thermal resistance	45.2	53.1	°C/W
R_qJB	Junction-to-board thermal resistance	60.6	66.4	°C/W
Y_JT	Junction-to-top characterization parameter	5.9	8.9	°C/W
Y_JB	Junction-to-board characterization parameter	60	65.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.