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ZHCSP13A september 2021 – june 2023 LMK1D1204P

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK1D1204P	UNIT
		RHD (VQFN)
		28 PINS
R_θJA	Junction-to-ambient thermal resistance	38.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	32.1	°C/W
R_θJB	Junction-to-board thermal resistance	18.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	1	°C/W
Ψ_JB	Junction-to-board characterization parameter	18.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	8.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.