米6体育平台手机版

ZHCSP66A october 2021 – april 2023 LMK1D1212 , LMK1D1216

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK1D1212	LMK1D1216	UNIT
		RHA (VQFN)	RGZ (VQFN)
		40 PINS	48 PINS
R_θJA	Junction-to-ambient thermal resistance	30.3	30.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	21.6	21.2	°C/W
R_θJB	Junction-to-board thermal resistance	13.1	12.9	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.4	0.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	13	12.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.5	4.5	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.