ZHCSP67A October 2021 – January 2022 LMK1D2106 , LMK1D2108
PRODUCTION DATA
| THERMAL METRIC(1) | LMK1D2106 | LMK1D2108 | UNIT | |
|---|---|---|---|---|
| RHA (VQFN) | RGZ (VQFN) | |||
| 40 PINS | 48 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 30.3 | 30.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 21.6 | 21.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13.1 | 12.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.4 | 0.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 13 | 12.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.5 | 4.5 | °C/W |