ZHCSOZ4 September   2022 LMK5B33414

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
    2. 7.2 Output Clock Test Configurations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL
        1. 8.2.2.1 Independent DPLL Operation
        2. 8.2.2.2 Cascaded DPLL Operation
        3. 8.2.2.3 APLL Cascaded With DPLL
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO)
      2. 8.3.2  Reference Inputs
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
        1. 8.3.5.1 Hitless Switching With Phase Cancellation
        2. 8.3.5.2 Hitless Switching With Phase Slew Control
        3. 8.3.5.3 Hitless Switching With 1-PPS Inputs
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Frequency Monitoring
          3. 8.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 8.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 8.3.7.2.5 Phase Valid Monitor for 1-PPS Inputs
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
          1. 8.3.8.1.1 APLL Phase Detector Frequency
          2. 8.3.8.1.2 APLL VCO Frequency
          3. 8.3.8.1.3 DPLL TDC Frequency
          4. 8.3.8.1.4 DPLL VCO Frequency
          5. 8.3.8.1.5 Clock Output Frequency
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL XO Reference (R) Divider
        4. 8.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 8.3.8.5  APLL Feedback Divider Paths
          1. 8.3.8.5.1 APLL N Divider With SDM
        6. 8.3.8.6  APLL Loop Filters (LF1, LF2, LF3)
        7. 8.3.8.7  APLL Voltage-Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 8.3.8.7.1 VCO Calibration
        8. 8.3.8.8  APLL VCO Clock Distribution Paths
        9. 8.3.8.9  DPLL Reference (R) Divider Paths
        10. 8.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 8.3.8.11 DPLL Loop Filter (DLF)
        12. 8.3.8.12 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Channel Muxes
      11. 8.3.11 Output Dividers (OD)
      12. 8.3.12 SYSREF/1-PPS
      13. 8.3.13 Output Delay
      14. 8.3.14 Clock Outputs (OUTx_P/N)
        1. 8.3.14.1 Differential Output
        2. 8.3.14.2 LVCMOS Output
        3. 8.3.14.3 SYSREF/1-PPS Output Replication
        4. 8.3.14.4 Output Auto-Mute During LOL
      15. 8.3.15 Glitchless Output Clock Start-Up
      16. 8.3.16 Clock Output Interfacing and Termination
      17. 8.3.17 Output Synchronization (SYNC)
      18. 8.3.18 Zero-Delay Mode (ZDM)
      19. 8.3.19 Time Elapsed Counter (TEC)
        1. 8.3.19.1 Configuring TEC Functionality
        2. 8.3.19.2 SPI as a Trigger Source
        3. 8.3.19.3 GPIO Pin as a TEC Trigger Source
          1. 8.3.19.3.1 An Example: Making a Time Elapsed Measurement Using TEC and GPIO1 as Trigger
        4. 8.3.19.4 TEC Timing
        5. 8.3.19.5 Other TEC Behavior
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Start-Up
        1. 8.4.1.1 ROM Selection
        2. 8.4.1.2 EEPROM Overlay
      2. 8.4.2 DPLL Operating States
        1. 8.4.2.1 Free-Run
        2. 8.4.2.2 Lock Acquisition
        3. 8.4.2.3 DPLL Locked
        4. 8.4.2.4 Holdover
      3. 8.4.3 PLL Start-Up Sequence
      4. 8.4.4 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 8.4.4.1 DPLL DCO Control
          1. 8.4.4.1.1 DPLL DCO Relative Adjustment Frequency Step Size
          2. 8.4.4.1.2 APLL DCO Frequency Step Size
      5. 8.4.5 APLL Frequency Control
      6. 8.4.6 Zero-Delay Mode Synchronization
      7. 8.4.7 DPLL Programmable Phase Delay
    5. 8.5 Programming
      1. 8.5.1 Interface and Control
      2. 8.5.2 I2C Serial Interface
        1. 8.5.2.1 I2C Block Register Transfers
      3. 8.5.3 SPI Serial Interface
        1. 8.5.3.1 SPI Block Register Transfer
      4. 8.5.4 Register Map Generation
      5. 8.5.5 General Register Programming Sequence
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PD#) Pin
      3. 9.1.3 Strap Pins for Start-Up
      4. 9.1.4 Pin States
      5. 9.1.5 ROM and EEPROM
      6. 9.1.6 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.6.1 Power-On Reset (POR) Circuit
        2. 9.1.6.2 Powering Up From a Single-Supply Rail
        3. 9.1.6.3 Power Up From Split-Supply Rails
        4. 9.1.6.4 Non-Monotonic or Slow Power-Up Supply Ramp
      7. 9.1.7 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Clock Tree Architect Programming Software
        2. 10.1.1.2 Texas Instruments Clocks and Synthesizers (TICS) Pro Software
        3. 10.1.1.3 PLLatinum™ Simulation Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 术语表
    7. 10.7 静电放电警告
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.5.1 Layout Guidelines

  • Isolate input, XO/OCXO/TCXO and output clocks from adjacent clocks with different frequencies and other nearby dynamic signals.
  • Consider the XO/OCXO/TCXO placement and layout in terms of the supply/ground noise and thermal gradients from nearby circuitry (for example, power supplies, FPGA, ASIC) as well as system-level vibration and shock. These factors can affect the frequency stability/accuracy and transient performance of the oscillator.
  • Avoid impedance discontinuities on controlled-impedance 50-Ω single-ended (or 100-Ω differential) traces for clock and dynamic logic signals.
  • Place bypass capacitors close to the VDD and VDDO pins on the same side as the IC, or directly below the IC pins on the opposite side of the PCB. Larger decoupling capacitor values can be placed further away.
  • Place external capacitors close to the CAP_x and LFx pins.
  • Use multiple vias to connect wide supply traces to the respective power islands or planes if possible.
  • Use at least a 6×6 through-hole via pattern to connect the IC ground/thermal pad to the PCB ground planes.
  • See the Land Pattern Example, Solder Mask Details, and Solder Paste Example in Section 11.
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