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ZHCSFA1C June 2016 – November 2017 LMK60A0-148351 , LMK60A0-148M , LMK60E0-156257 , LMK60E2-150M

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

SIA|6

散热焊盘机械数据 (封装 | 引脚)

订购信息

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6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK60XX ⁽²⁾⁽³⁾⁽⁴⁾			UNIT
		SIA (QFM)
		6 PINS
		Airflow (LFM) 0	Airflow (LFM) 200	Airflow (LFM) 400
R_θJA	Junction-to-ambient thermal resistance	55.2	46.4	43.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	34.6	n/a	n/a	°C/W
R_θJB	Junction-to-board thermal resistance	37.7	n/a	n/a	°C/W
ψ_JT	Junction-to-top characterization parameter	11.3	17.6	22.5	°C/W
ψ_JB	Junction-to-board characterization parameter	37.7	41.5	40.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package thermal resistance is calculated on a 4 layer JEDEC board.

(3) Connected to GND with 3 thermal vias (0.3-mm diameter).

(4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. See the Layout Guidelines section for more information on ensuring good system reliability and quality.