ZHCSFA1C June 2016 – November 2017 LMK60A0-148351 , LMK60A0-148M , LMK60E0-156257 , LMK60E2-150M
PRODUCTION DATA.
The LMK60XX is a high performance device. Therefore pay careful attention to device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 12, to maximize thermal dissipation out of the package.
Equation 1 describes the relationship between the PCB temperature around the LMK60XX and its junction temperature.
where
To ensure that the maximum junction temperature of LMK60XX is below 120°C, it can be calculated that the maximum PCB temperature without airflow should be at 90°C or below when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.68 W.