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ZHCSFX5C December 2016 – December 2017 LMK60E0-156M , LMK60E0-212M , LMK60E2-100M , LMK60E2-125M , LMK60E2-156M , LMK60I2-100M , LMK60I2-322M

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

SIA|6

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK60EX ⁽²⁾⁽³⁾⁽⁴⁾	UNIT
		SIA (QFM)
		6 PINS
		Airflow (LFM) 0
R_θJA	Junction-to-ambient thermal resistance	74.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	46.7	°C/W
R_θJB	Junction-to-board thermal resistance	49.0	°C/W
ψ_JT	Junction-to-top characterization parameter	14.8	°C/W
ψ_JB	Junction-to-board characterization parameter	48.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package thermal resistance is calculated on a 4 layer JEDEC board.

(3) Connected to GND with 2 thermal vias (0.3-mm diameter).

(4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. Please refer to Thermal Considerations section for more information on ensuring good system reliability and quality.