ZHCSG14D October   2015  – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      引脚分配
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Supply
    6. 6.6  LVPECL Output Characteristics
    7. 6.7  LVDS Output Characteristics
    8. 6.8  HCSL Output Characteristics
    9. 6.9  OE Input Characteristics
    10. 6.10 Frequency Tolerance Characteristics
    11. 6.11 Power-On/Reset Characteristics (VDD)
    12. 6.12 PSRR Characteristics
    13. 6.13 PLL Clock Output Jitter Characteristics
    14. 6.14 Typical 156.25-MHz Output Phase Noise Characteristics
    15. 6.15 Additional Reliability and Qualification
    16. 6.16 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Ensuring Thermal Reliability
      2. 9.1.2 Best Practices for Signal Integrity
      3. 9.1.3 Recommended Solder Reflow Profile
  10. 10器件和文档支持
    1. 10.1 相关链接
    2. 10.2 接收文档更新通知
    3. 10.3 社区资源
    4. 10.4 商标
    5. 10.5 静电放电警告
    6. 10.6 Glossary
  11. 11机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIA|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.10 Frequency Tolerance Characteristics(1)

VDD = 3.3 V ± 5%, TA = –40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fT Total frequency tolerance LMK61X2: All output formats, frequency bands and device junction temperature up to 125°C; includes initial freq tolerance, temperature & supply voltage variation, solder reflow and aging (10 years) –50 50 ppm
LMK61X0: All output formats, frequency bands and device junction temperature up to 115°C; includes initial freq tolerance, temperature & supply voltage variation, solder reflow and aging (5 years at 40°C) –25 25 ppm
(1) Ensured by characterization.
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