ZHCSE74B
September 2015 – February 2017
LMK61E2
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
修订历史记录
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics - Power Supply
6.6
LVPECL Output Characteristics
6.7
LVDS Output Characteristics
6.8
HCSL Output Characteristics
6.9
OE Input Characteristics
6.10
ADD Input Characteristics
6.11
Frequency Tolerance Characteristics
6.12
Power-On/Reset Characteristics (VDD)
6.13
I2C-Compatible Interface Characteristics (SDA, SCL)
6.14
PSRR Characteristics
6.15
Other Characteristics
6.16
PLL Clock Output Jitter Characteristics
6.17
Typical 156.25-MHz Output Phase Noise Characteristics
6.18
Typical 161.1328125 MHz Output Phase Noise Characteristics
6.19
Additional Reliability and Qualification
6.20
Typical Characteristics
7
Parameter Measurement Information
7.1
Device Output Configurations
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Device Block-Level Description
8.3.2
Device Configuration Control
8.3.3
Register File Reference Convention
8.3.4
Configuring the PLL
8.3.5
Integrated Oscillator
8.3.6
Reference Doubler
8.3.7
Phase Frequency Detector
8.3.8
Feedback Divider (N)
8.3.9
Fractional Circuitry
8.3.10
Charge Pump
8.3.11
Loop Filter
8.3.12
VCO Calibration
8.3.13
High-Speed Output Divider
8.3.14
High-Speed Clock Output
8.3.15
Device Status
8.3.15.1
Loss of Lock
8.4
Device Functional Modes
8.4.1
Interface and Control
8.5
Programming
8.5.1
I2C Serial Interface
8.5.2
Block Register Write
8.5.3
Block Register Read
8.5.4
Write SRAM
8.5.5
Write EEPROM
8.5.6
Read SRAM
8.5.7
Read EEPROM
8.6
EEPROM Map
8.7
Register Map
8.7.1
Register Descriptions
8.7.1.1
VNDRID_BY1 Register; R0
8.7.1.2
VNDRID_BY0 Register; R1
8.7.1.3
PRODID Register; R2
8.7.1.4
REVID Register; R3
8.7.1.5
SLAVEADR Register; R8
8.7.1.6
EEREV Register; R9
8.7.1.7
DEV_CTL Register; R10
8.7.1.8
XO_CAPCTRL_BY1 Register; R16
8.7.1.9
XO_CAPCTRL_BY0 Register; R17
8.7.1.10
DIFFCTL Register; R21
8.7.1.11
OUTDIV_BY1 Register; R22
8.7.1.12
OUTDIV_BY0 Register; R23
8.7.1.13
PLL_NDIV_BY1 Register; R25
8.7.1.14
PLL_NDIV_BY0 Register; R26
8.7.1.15
PLL_FRACNUM_BY2 Register; R27
8.7.1.16
PLL_FRACNUM_BY1 Register; R28
8.7.1.17
PLL_FRACNUM_BY0 Register; R29
8.7.1.18
PLL_FRACDEN_BY2 Register; R30
8.7.1.19
PLL_FRACDEN_BY1 Register; R31
8.7.1.20
PLL_FRACDEN_BY0 Register; R32
8.7.1.21
PLL_MASHCTRL Register; R33
8.7.1.22
PLL_CTRL0 Register; R34
8.7.1.23
PLL_CTRL1 Register; R35
8.7.1.24
PLL_LF_R2 Register; R36
8.7.1.25
PLL_LF_C1 Register; R37
8.7.1.26
PLL_LF_R3 Register; R38
8.7.1.27
PLL_LF_C3 Register; R39
8.7.1.28
PLL_CALCTRL Register; R42
8.7.1.29
NVMSCRC Register; R47
8.7.1.30
NVMCNT Register; R48
8.7.1.31
NVMCTL Register; R49
8.7.1.32
MEMADR Register; R51
8.7.1.33
NVMDAT Register; R52
8.7.1.34
RAMDAT Register; R53
8.7.1.35
NVMUNLK Register; R56
8.7.1.36
INT_LIVE Register; R66
8.7.1.37
SWRST Register; R72
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Jitter Considerations in Serdes Systems
9.2.2
Frequency Margining
9.2.2.1
Fine Frequency Margining
9.2.2.2
Coarse Frequency Margining
9.2.3
Design Requirements
9.2.3.1
Detailed Design Procedure
9.2.3.1.1
Custom Design With WEBENCH® Tools
9.2.3.1.2
Device Selection
9.2.3.1.3
VCO Frequency Calculation
9.2.3.1.4
Device Configuration
9.2.3.1.5
PLL Loop Filter Design
9.2.3.1.6
Spur Mitigation Techniques
9.2.3.1.6.1
Phase Detection Spur
9.2.3.1.6.2
Integer Boundary Fractional Spur
9.2.3.1.6.3
Primary Fractional Spur
9.2.3.1.6.4
Sub-Fractional Spur
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Ensured Thermal Reliability
11.1.2
Best Practices for Signal Integrity
11.1.3
Recommended Solder Reflow Profile
11.2
Layout Example
12
器件和文档支持
12.1
器件支持
12.1.1
开发支持
12.1.1.1
使用 WEBENCH® 工具定制设计方案
12.2
文档支持
12.2.1
相关文档
12.3
接收文档更新通知
12.4
社区资源
12.5
商标
12.6
静电放电警告
12.7
Glossary
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
SIA|8
MPSI062A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcse74b_oa
zhcse74b_pm
7
Parameter Measurement Information
7.1
Device Output Configurations
Figure 16.
LVPECL Output DC Configuration During Device Test
Figure 17.
LVDS Output DC Configuration During Device Test
Figure 18.
HCSL Output DC Configuration During Device Test
Figure 19.
LVPECL Output AC Configuration During Device Test
Figure 20.
LVDS Output AC Configuration During Device Test
Figure 21.
HCSL Output AC Configuration During Device Test
Figure 22.
PSRR Test Setup
Figure 23.
Differential Output Voltage and Rise/Fall Time
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