米6体育平台手机版

ZHCSGL2E December 2016 – December 2023 LMK62A2-100M , LMK62A2-150M , LMK62A2-156M , LMK62A2-200M , LMK62A2-266M , LMK62E0-156M , LMK62E2-100M , LMK62E2-156M , LMK62I0-100M , LMK62I0-156M

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

SIA|6

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMK62XX ⁽²⁾ ⁽³⁾ ⁽⁴⁾	UNIT
		SIA (QFM )
		6 PINS
		Airflow (LFM) 0
R_θJA	Junction-to-ambient thermal resistance	94.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	65.1	°C/W
R_θJB	Junction-to-board thermal resistance	59	°C/W
ψ_JT	Junction-to-top characterization parameter	23.3	°C/W
ψ_JB	Junction-to-board characterization parameter	64.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package thermal resistance is calculated on a 4-layer JEDEC board.

(3) Connected to GND with 2 thermal vias (0.3-mm diameter).

(4) ψ_JB (junction to board) is used when the main heat flow is from the junction to the GND pad. Please refer to Thermal Considerations section for more information on ensuring good system reliability and quality.